Conventional universal boards for testing and prototyping of circuits cannot be applied to RF measurement due to their poor frequency characteristics. This paper introduces a universal board for RF circuits that consist of surface mount type SSOP (Shrink Small Outline Package) elements. Metal lines and ground planes are regularly arranged so that ground-coplanar-waveguide-like structure is obtained, and implementation of an additional seal substrate for assembling an RF connector is presented. Examples of prototyping and measurement are shown, and frequency characteristics are discussed.
(英)
Conventional universal boards for testing and prototyping of circuits cannot be applied to RF measurement due to their poor frequency characteristics. This paper introduces a universal board for RF circuits that consist of surface mount type SSOP (Shrink Small Outline Package) elements. Metal lines and ground planes are regularly arranged so that ground-coplanar-waveguide-like structure is obtained, and implementation of an additional seal substrate for assembling an RF connector is presented. Examples of prototyping and measurement are shown, and frequency characteristics are discussed.