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| Presentation | 2022-08-08 15:20 Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.)  SDM2022-40 ICD2022-8 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. However, the exposed backside of the IC can cause EMC problems such as permanent or temporary failures due to exposure to all kinds of disturbances. Furthermore, the risk of physical attacks that exploit EMC vulnerabilities is also considered to increase. In this study, a prototype chip was fabricated to quantitatively evaluate backside voltage disturbances. The prototype chip is equipped with an on-chip monitoring circuit created with a SAR ADC, which enables measurement of silicon substrate voltages at multiple locations. Voltage disturbances were actually injected from the backside, and the voltage waveforms on the chip surface and their position dependence were confirmed. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Flip Chip Packaging / SAR ADC / Disturbance / Fault Injection / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 122, no. 149, ICD2022-8, pp. 27-30, Aug. 2022. | |
| Paper # | ICD2022-8 | |
| Date of Issue | 2022-08-01 (SDM, ICD) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2022-40 ICD2022-8 |
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| Conference Information | |
| Committee | ICD SDM ITE-IST |
| Conference Date | 2022-08-08 - 2022-08-10 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2022-08-ICD-SDM-IST |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging |
| Sub Title (in English) | |
| Keyword(1) | Flip Chip Packaging |
| Keyword(2) | SAR ADC |
| Keyword(3) | Disturbance |
| Keyword(4) | Fault Injection |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Takuya Wadatsumi |
| 1st Author's Affiliation | Kobe University (Kobe Univ.) |
| 2nd Author's Name | Kohei Kawai |
| 2nd Author's Affiliation | Kobe University (Kobe Univ.) |
| 3rd Author's Name | Rikuu Hasegawa |
| 3rd Author's Affiliation | Kobe University (Kobe Univ.) |
| 4th Author's Name | Kikuo Muramatsu |
| 4th Author's Affiliation | e-SYNC Co., Ltd. (e-SYNC) |
| 5th Author's Name | Hiromu Hasegawa |
| 5th Author's Affiliation | MegaChips Corp. (Megachips) |
| 6th Author's Name | Takuya Sawada |
| 6th Author's Affiliation | MegaChips Corp. (Megachips) |
| 7th Author's Name | Takahito Fukushima |
| 7th Author's Affiliation | MegaChips Corp. (Megachips) |
| 8th Author's Name | Hisashi Kondo |
| 8th Author's Affiliation | MegaChips Corp. (Megachips) |
| 9th Author's Name | Takuji Miki |
| 9th Author's Affiliation | Kobe University (Kobe Univ.) |
| 10th Author's Name | Makoto Nagata |
| 10th Author's Affiliation | Kobe University (Kobe Univ.) |
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| Speaker | Author-1 |
| Date Time | 2022-08-08 15:20:00 |
| Presentation Time | 25 minutes |
| Registration for | ICD |
| Paper # | SDM2022-40, ICD2022-8 |
| Volume (vol) | vol.122 |
| Number (no) | no.148(SDM), no.149(ICD) |
| Page | pp.27-30 |
| #Pages | 4 |
| Date of Issue | 2022-08-01 (SDM, ICD) |
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