Paper Abstract and Keywords |
Presentation |
2022-03-04 10:55
Reduction of radiated noise in the printed wiring board power supply layer
-- Effect of resistance structure -- Shuitiro Kotaki, Sinichi Sasaki (Saga Univ) EMCJ2021-73 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In recent years, with the multi-functionalization of information devices, radiation noise by power supply noise waves in a circuit board generated by the high-speed operation of the mounted LSI is a problem. In this laboratory, a method is proposed to add resistance between the power supply layers at the end of the substrate and reduce noise. So far, it has been confirmed that the same resistance value as the characteristic impedance value of the line having the resistor addition pitch is effective. However, depending on the addition method and structure to the substrate end, the noise wave was not optimal resistance value. In this study, the purpose is to clarify the optimal resistance value due to the difference in addition method and structure. Currently, we are examining the case where the alignment resistance is added to the substrate end of the flat substrate and the circular substrate as a structure. As a result of the characteristic impedance evaluation by three-dimensional electrical field analysis so far, it was confirmed that there is a difference in the optimum value by the structure. In the future, we will investigate the resistance value effective for reducing radiation noise. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Radiation noise / Characteristic impedance / / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 121, no. 403, EMCJ2021-73, pp. 7-10, March 2022. |
Paper # |
EMCJ2021-73 |
Date of Issue |
2022-02-25 (EMCJ) |
ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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EMCJ2021-73 |
Conference Information |
Committee |
MICT EMCJ |
Conference Date |
2022-03-04 - 2022-03-04 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Online |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Healthcare and Medical Information Communication Technologies, EMC, etc |
Paper Information |
Registration To |
EMCJ |
Conference Code |
2022-03-MICT-EMCJ |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Reduction of radiated noise in the printed wiring board power supply layer |
Sub Title (in English) |
Effect of resistance structure |
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Radiation noise |
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Characteristic impedance |
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1st Author's Name |
Shuitiro Kotaki |
1st Author's Affiliation |
Saga University Graduate School (Saga Univ) |
2nd Author's Name |
Sinichi Sasaki |
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Saga University (Saga Univ) |
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Speaker |
Author-1 |
Date Time |
2022-03-04 10:55:00 |
Presentation Time |
20 minutes |
Registration for |
EMCJ |
Paper # |
EMCJ2021-73 |
Volume (vol) |
vol.121 |
Number (no) |
no.403 |
Page |
pp.7-10 |
#Pages |
4 |
Date of Issue |
2022-02-25 (EMCJ) |
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