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| Presentation | 2021-11-18 13:05 4-way Power Combiner Including Board-to-Board Transition Using Spring Contact Probes Takuma Nishimura, Hidenori Ishibashi, Yutarou Yamaguchi, Takumi Nagamine, Hidenori Yukawa, Toru Fukasawa, Yoshio Inasawa (MELCO)  MW2021-66 Link to ES Tech. Rep. Archives: MW2021-66 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Conventional SSPA has a method of synthesizing power by mounting multiple MMIC on the board with flip-chip bonding for high power application. However, it is difficult to reduce loss and dissipate heat properly. We proposed a compact, low-loss, high heat dissipative 4-way power combiner applied MMIC with flip-chip bonding. This structure consists of 2-way Power combiner using Air-filled SIW(ASIW), Gysel Power combiner formed on glass substrate, board-to-board transitions using spiring probes. In this way, we can realize Miniaturization and reducing loss by applying to both ASIW and glass substrate. In addition, MMIC and the metal plate are closed contact each other to reduce thermal resistance by using spring probes. We designed and fabricated the proposed structure. As a result, calculated and measured results are consisted approximately. So, combiner loss of the prototype is considered 0.5~1.0dB. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | SSPA / Modules / Power Combiner / Spring contact Probes / Air-filled SIW / Glass Substrate / / | |
| Reference Info. | IEICE Tech. Rep., vol. 121, no. 254, MW2021-66, pp. 1-6, Nov. 2021. | |
| Paper # | MW2021-66 | |
| Date of Issue | 2021-11-11 (MW) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | MW2021-66 Link to ES Tech. Rep. Archives: MW2021-66 |
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| Conference Information | |
| Committee | MW |
| Conference Date | 2021-11-18 - 2021-11-19 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kagoshima University |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Microwave |
| Paper Information | |
| Registration To | MW |
| Conference Code | 2021-11-MW |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 4-way Power Combiner Including Board-to-Board Transition Using Spring Contact Probes |
| Sub Title (in English) | |
| Keyword(1) | SSPA |
| Keyword(2) | Modules |
| Keyword(3) | Power Combiner |
| Keyword(4) | Spring contact Probes |
| Keyword(5) | Air-filled SIW |
| Keyword(6) | Glass Substrate |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Takuma Nishimura |
| 1st Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 2nd Author's Name | Hidenori Ishibashi |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 3rd Author's Name | Yutarou Yamaguchi |
| 3rd Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 4th Author's Name | Takumi Nagamine |
| 4th Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 5th Author's Name | Hidenori Yukawa |
| 5th Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 6th Author's Name | Toru Fukasawa |
| 6th Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
| 7th Author's Name | Yoshio Inasawa |
| 7th Author's Affiliation | Mitsubishi Electric Corporation (MELCO) |
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| Speaker | Author-1 |
| Date Time | 2021-11-18 13:05:00 |
| Presentation Time | 25 minutes |
| Registration for | MW |
| Paper # | MW2021-66 |
| Volume (vol) | vol.121 |
| Number (no) | no.254 |
| Page | pp.1-6 |
| #Pages | 6 |
| Date of Issue | 2021-11-11 (MW) |
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