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Paper Abstract and Keywords
Presentation 2021-01-22 14:40
Construction of 3D Analysis Model due to Signal Transmission Evaluation in Connector
Taiki Kitazawa (NIT,Nagano College), Hiroyuki Ueda, Fujimoto Daisuke, Youngwoo Kim, Hayashi Yuichi (NAIST), Kasuga Takashi (NIT,Nagano College) EMCJ2020-67
Abstract (in Japanese) (See Japanese page) 
(in English) As high-speed transmission of big data progresses, Signal Integrity (SI) degradation and Electromagnetic Interference (EMI) occur due to discontinuities of the signal line structure and degradation of the contact boundary of connector in Print Circuit Boards (PCBs) and connectors and cables. In this study, in order to investigate the causes of SI and EMI on connectors, an FDTD analysis system that can incorporate 3D models was developed. In this system, the connector and the board are modeled by 3D CAD and incorporated into the FDTD analysis by using slicer software. Differential Impedance was measured by differential TDR method on a model that interconnects a USB-TypeA connector and differential lines. As shortening the rise time of the step pulse, it was found that the discontinuities of the signal line structure caused an impedance mismatch and show its usefulness as an analysis system of the connector.
Keyword (in Japanese) (See Japanese page) 
(in English) USB connector / FDTD analysis method / Differential TDR / Impedance mismatch / / / /  
Reference Info. IEICE Tech. Rep., vol. 120, no. 333, EMCJ2020-67, pp. 18-23, Jan. 2021.
Paper # EMCJ2020-67 
Date of Issue 2021-01-15 (EMCJ) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMCJ  
Conference Date 2021-01-22 - 2021-01-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMCJ 
Conference Code 2021-01-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Construction of 3D Analysis Model due to Signal Transmission Evaluation in Connector 
Sub Title (in English)  
Keyword(1) USB connector  
Keyword(2) FDTD analysis method  
Keyword(3) Differential TDR  
Keyword(4) Impedance mismatch  
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1st Author's Name Taiki Kitazawa  
1st Author's Affiliation National Institute of Technology, Nagano College (NIT,Nagano College)
2nd Author's Name Hiroyuki Ueda  
2nd Author's Affiliation Nara Institute of Science and Technology (NAIST)
3rd Author's Name Fujimoto Daisuke  
3rd Author's Affiliation Nara Institute of Science and Technology (NAIST)
4th Author's Name Youngwoo Kim  
4th Author's Affiliation Nara Institute of Science and Technology (NAIST)
5th Author's Name Hayashi Yuichi  
5th Author's Affiliation Nara Institute of Science and Technology (NAIST)
6th Author's Name Kasuga Takashi  
6th Author's Affiliation National Institute of Technology, Nagano College (NIT,Nagano College)
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Speaker
Date Time 2021-01-22 14:40:00 
Presentation Time 25 
Registration for EMCJ 
Paper # IEICE-EMCJ2020-67 
Volume (vol) IEICE-120 
Number (no) no.333 
Page pp.18-23 
#Pages IEICE-6 
Date of Issue IEICE-EMCJ-2021-01-15 


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