IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2020-11-20 10:30
[Invited Talk] Power Device Degradation Estimation by Machine Learning of Gate Waveforms
Hiromu Yamasaki, Koutaro Miyazaki, Yang Lo, A. K. M. Mahfuzul Islam, Katsuhiro Hata, Takayasu Sakurai, Makoto Takamiya (Univ. of Tokyo) SDM2020-29 Link to ES Tech. Rep. Archives: SDM2020-29
Abstract (in Japanese) (See Japanese page) 
(in English) A method to detect bonding wire lift-off of SiC MOSFETs using machine learning from the gate voltage waveform is proposed. In this paper, we proposed a new method that can be applied to 3-terminal SiC MOSFETs without the need for insulation compared to the conventional bonding wire lift-off detection method and demonstrated its effectiveness by SPICE simulation. By applying a linear regression algorithm to the two parameters extracted from the gate voltage waveform, we succeeded in constructing a bonding wire lift-off detection method that is robust to load current and temperature fluctuations.
Keyword (in Japanese) (See Japanese page) 
(in English) Linear regression / Machine learning / Power device / Reliability / Gate / / /  
Reference Info. IEICE Tech. Rep., vol. 120, no. 239, SDM2020-29, pp. 32-35, Nov. 2020.
Paper # SDM2020-29 
Date of Issue 2020-11-12 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2020-29 Link to ES Tech. Rep. Archives: SDM2020-29

Conference Information
Committee SDM  
Conference Date 2020-11-19 - 2020-11-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2020-11-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Power Device Degradation Estimation by Machine Learning of Gate Waveforms 
Sub Title (in English)  
Keyword(1) Linear regression  
Keyword(2) Machine learning  
Keyword(3) Power device  
Keyword(4) Reliability  
Keyword(5) Gate  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiromu Yamasaki  
1st Author's Affiliation The University of Tokyo (Univ. of Tokyo)
2nd Author's Name Koutaro Miyazaki  
2nd Author's Affiliation The University of Tokyo (Univ. of Tokyo)
3rd Author's Name Yang Lo  
3rd Author's Affiliation The University of Tokyo (Univ. of Tokyo)
4th Author's Name A. K. M. Mahfuzul Islam  
4th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
5th Author's Name Katsuhiro Hata  
5th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
6th Author's Name Takayasu Sakurai  
6th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
7th Author's Name Makoto Takamiya  
7th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-7 
Date Time 2020-11-20 10:30:00 
Presentation Time 60 minutes 
Registration for SDM 
Paper # SDM2020-29 
Volume (vol) vol.120 
Number (no) no.239 
Page pp.32-35 
#Pages
Date of Issue 2020-11-12 (SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan