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Paper Abstract and Keywords
Presentation 2020-10-22 14:50
Modification of states of copper and copper oxide due to IPA treatment
Takezo Mawaki (Tohoku Univ.), Akinobu Teramoto (Hiroshima Univ.), Katsutoshi Ishii (Tokyo Electron Technology Solutions), Yoshinobu Shiba, Tomoyuki Suwa (Tohoku Univ.), Shuji Azumo, Akira Shimizu, Kota Umezawa (Tokyo Electron Technology Solutions), Rihito Kuroda, Yasuyuki Shirai, Shigetoshi Sugawa (Tohoku Univ.) SDM2020-19
Abstract (in Japanese) (See Japanese page) 
(in English) The reduction of copper oxide by isopropyl alcohol (IPA) gas and its mechanism were investigated toward the selective process of copper (Cu) wiring. Also the decomposition behavior of IPA gas during the IPA treatment on Cu and copper oxide surfaces was studied. The decomposition and reaction behaviors and adsorption characteristics of IPA were investigated by the Fourier transform infrared spectroscopy (FT-IR). The chemical structures of the Cu and copper oxide surfaces before and after IPA treatment were analyzed by X-ray photoelectron spectroscopy (XPS). Based on the experiments, the process condition to induce reduction of copper oxide by IPA gas within the Cu processes temperature range was identified. Also, the decomposition behavior of IPA gas on Cu and copper oxide surfaces was clarified.
Keyword (in Japanese) (See Japanese page) 
(in English) IPA / Cu / AS-ALD / SAM / FT-IR / XPS / Reduction /  
Reference Info. IEICE Tech. Rep., vol. 120, no. 205, SDM2020-19, pp. 25-29, Oct. 2020.
Paper # SDM2020-19 
Date of Issue 2020-10-15 (SDM) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2020-10-22 - 2020-10-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process Science and New Process Technology 
Paper Information
Registration To SDM 
Conference Code 2020-10-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Modification of states of copper and copper oxide due to IPA treatment 
Sub Title (in English)  
Keyword(1) IPA  
Keyword(2) Cu  
Keyword(3) AS-ALD  
Keyword(4) SAM  
Keyword(5) FT-IR  
Keyword(6) XPS  
Keyword(7) Reduction  
Keyword(8)  
1st Author's Name Takezo Mawaki  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Akinobu Teramoto  
2nd Author's Affiliation Hiroshima University (Hiroshima Univ.)
3rd Author's Name Katsutoshi Ishii  
3rd Author's Affiliation Tokyo Electron Technology Solutions Ltd. (Tokyo Electron Technology Solutions)
4th Author's Name Yoshinobu Shiba  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Tomoyuki Suwa  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Shuji Azumo  
6th Author's Affiliation Tokyo Electron Technology Solutions Ltd. (Tokyo Electron Technology Solutions)
7th Author's Name Akira Shimizu  
7th Author's Affiliation Tokyo Electron Technology Solutions Ltd. (Tokyo Electron Technology Solutions)
8th Author's Name Kota Umezawa  
8th Author's Affiliation Tokyo Electron Technology Solutions Ltd. (Tokyo Electron Technology Solutions)
9th Author's Name Rihito Kuroda  
9th Author's Affiliation Tohoku University (Tohoku Univ.)
10th Author's Name Yasuyuki Shirai  
10th Author's Affiliation Tohoku University (Tohoku Univ.)
11th Author's Name Shigetoshi Sugawa  
11th Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker
Date Time 2020-10-22 14:50:00 
Presentation Time 30 
Registration for SDM 
Paper # IEICE-SDM2020-19 
Volume (vol) IEICE-120 
Number (no) no.205 
Page pp.25-29 
#Pages IEICE-5 
Date of Issue IEICE-SDM-2020-10-15 


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