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| Presentation | 2020-02-27 11:45 Detecting Resistive-Open Defects of Power TSVs in 3D-ICs Koutaro Hachiya (Teikyo Heisei Univ.), Atsushi Kurokawa (Hirosaki Univ.)  CAS2019-104 CS2019-104 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | A method is proposed which detects resistive-open defects of power TSVs in PDNs by measuring resistance between power micro-bumps. Utilizing the monotonically increasing property of the measured resistance between power micro-bumps when the resistance of TSV under test increases, the method defines the minimum defective resistance $R_{¥it min}$ of TSVs and uses it as the resistance of defective TSV in statistical fault simulations. Simulation results of a 3D-IC example with two dies show that the proposed method can detect resistive opens although defect coverage is decreased when $R_{¥it min}$ is decreased. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D-IC / TSV / testing power distribution network / resistive open defect / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 119, no. 423, CAS2019-104, pp. 37-41, Feb. 2020. | |
| Paper # | CAS2019-104 | |
| Date of Issue | 2020-02-20 (CAS, CS) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CAS2019-104 CS2019-104 |
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| Conference Information | |
| Committee | CS CAS |
| Conference Date | 2020-02-27 - 2020-02-28 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Network processor, Signal processing and circuits for communications, Wireless LAN / PAN, etc. |
| Paper Information | |
| Registration To | CAS |
| Conference Code | 2020-02-CS-CAS |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Detecting Resistive-Open Defects of Power TSVs in 3D-ICs |
| Sub Title (in English) | |
| Keyword(1) | 3D-IC |
| Keyword(2) | TSV |
| Keyword(3) | testing power distribution network |
| Keyword(4) | resistive open defect |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Koutaro Hachiya |
| 1st Author's Affiliation | Teikyo Heisei University (Teikyo Heisei Univ.) |
| 2nd Author's Name | Atsushi Kurokawa |
| 2nd Author's Affiliation | Hirosaki University (Hirosaki Univ.) |
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| Speaker | Author-1 |
| Date Time | 2020-02-27 11:45:00 |
| Presentation Time | 25 minutes |
| Registration for | CAS |
| Paper # | CAS2019-104, CS2019-104 |
| Volume (vol) | vol.119 |
| Number (no) | no.423(CAS), no.424(CS) |
| Page | pp.37-41 |
| #Pages | 5 |
| Date of Issue | 2020-02-20 (CAS, CS) |
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