講演抄録/キーワード |
講演名 |
2020-02-07 11:20
[招待講演]高精度デュアルダマシン加工技術 藤川 誠・山口達也(TTS)・菊地裕樹・前川 薫(TEL Technology Center, America)・河崎洋章・○飯塚洋二(東京エレクトロン) SDM2019-92 エレソ技報アーカイブへのリンク:SDM2019-92 |
抄録 |
(和) |
Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in the latest and upcoming highly dense integrated circuits. In order to reduce the exposure the low-k material to plasma, a novel volatile material, which can be removed simply by thermal energy is developed [1]-[7]. Utilizing this film as temporary sealing plug, it can protect the low-k dielectrics from being exposed to plasma during upcoming ashing processes, and furthermore. It can be removed easily without additional damage. In this paper, we demonstrate the effect of the volatile material by examining its filling property, electrical characteristics and reliability on the test pattern. |
(英) |
Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in the latest and upcoming highly dense integrated circuits. In order to reduce the exposure the low-k material to plasma, a novel volatile material, which can be removed simply by thermal energy is developed [1]-[7]. Utilizing this film as temporary sealing plug, it can protect the low-k dielectrics from being exposed to plasma during upcoming ashing processes, and furthermore. It can be removed easily without additional damage. In this paper, we demonstrate the effect of the volatile material by examining its filling property, electrical characteristics and reliability on the test pattern. |
キーワード |
(和) |
/ / / / / / / |
(英) |
Volatile material / Thermal removal / Plug material / Porous low-k material / Plasma damage / Ashing / / |
文献情報 |
信学技報, vol. 119, no. 410, SDM2019-92, pp. 21-23, 2020年2月. |
資料番号 |
SDM2019-92 |
発行日 |
2020-01-31 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
SDM2019-92 エレソ技報アーカイブへのリンク:SDM2019-92 |