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Paper Abstract and Keywords
Presentation 2019-11-27 16:35
30GHz bandwidth optical receiver module using flip chip assembly with micro solder ball
Atsunobu Ohta, Nobuyoshi Kawaguchi, Koudai Suzuki, Atsushi Kanayama, Manabu Wakabayashi, Hachinori Ogawa, Toshio Kawai (KYOSEMI), Tetsuya Kawanishi (Waseda Univ.) MWP2019-47
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
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(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 312, MWP2019-47, pp. 23-23, Nov. 2019.
Paper # MWP2019-47 
Date of Issue 2019-11-20 (MWP) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee MWP  
Conference Date 2019-11-27 - 2019-11-27 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Devices 
Paper Information
Registration To MWP 
Conference Code 2019-11-MWP 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 30GHz bandwidth optical receiver module using flip chip assembly with micro solder ball 
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1st Author's Name Atsunobu Ohta  
1st Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
2nd Author's Name Nobuyoshi Kawaguchi  
2nd Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
3rd Author's Name Koudai Suzuki  
3rd Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
4th Author's Name Atsushi Kanayama  
4th Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
5th Author's Name Manabu Wakabayashi  
5th Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
6th Author's Name Hachinori Ogawa  
6th Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
7th Author's Name Toshio Kawai  
7th Author's Affiliation KYOTO SEMICONDUCTOR Co., Ltd. (KYOSEMI)
8th Author's Name Tetsuya Kawanishi  
8th Author's Affiliation Waseda University (Waseda Univ.)
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Speaker
Date Time 2019-11-27 16:35:00 
Presentation Time 25 
Registration for MWP 
Paper # IEICE-MWP2019-47 
Volume (vol) IEICE-119 
Number (no) no.312 
Page p.23 
#Pages IEICE-1 
Date of Issue IEICE-MWP-2019-11-20 


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