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Paper Abstract and Keywords
Presentation 2019-11-15 14:15
Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers
Masahide Goto (NHK), Yuki Honda (NHK-ES), Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi (Univ. of Tokyo), Eiji Higurashi (AIST), Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. of Tokyo) ICD2019-38 IE2019-44
Abstract (in Japanese) (See Japanese page) 
(in English) We have studied on pixel-parallel three-dimensional (3D) integrated CMOS image sensors. We previously reported double-layered image sensors by direct bonding of silicon on insulator (SOI) layers with embedded Au electrodes, which confirmed pixel-parallel video images. We have newly designed the triple-layered ring oscillator and image sensor to demonstrate the concept of the multi-layered devices which improve the resolution and enhance the functionality. The developed triple-stacked wafers are confirmed to have no voids or separation of layers even after the removal of the handle layer, thereby demonstrating the feasibility of multi-layered imaging devices for the next-generation video systems.
Keyword (in Japanese) (See Japanese page) 
(in English) CMOS image sensor / 3D integration / ring oscillator / bonding / SOI / A/D converter / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 284, ICD2019-38, pp. 45-49, Nov. 2019.
Paper # ICD2019-38 
Date of Issue 2019-11-07 (ICD, IE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ICD2019-38 IE2019-44

Conference Information
Conference Date 2019-11-13 - 2019-11-15 
Place (in Japanese) (See Japanese page) 
Place (in English) Ehime Prefecture Gender Equality Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2019 -New Field of VLSI Design- 
Paper Information
Registration To ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Triple-Layered Ring Oscillators and Image Sensors Developed by Direct Bonding of SOI Wafers 
Sub Title (in English)  
Keyword(1) CMOS image sensor  
Keyword(2) 3D integration  
Keyword(3) ring oscillator  
Keyword(4) bonding  
Keyword(5) SOI  
Keyword(6) A/D converter  
1st Author's Name Masahide Goto  
1st Author's Affiliation NHK STRL (NHK)
2nd Author's Name Yuki Honda  
2nd Author's Affiliation NHK Engineering System (NHK-ES)
3rd Author's Name Toshihisa Watabe  
3rd Author's Affiliation NHK STRL (NHK)
4th Author's Name Kei Hagiwara  
4th Author's Affiliation NHK STRL (NHK)
5th Author's Name Masakazu Nanba  
5th Author's Affiliation NHK STRL (NHK)
6th Author's Name Yoshinori Iguchi  
6th Author's Affiliation NHK STRL (NHK)
7th Author's Name Takuya Saraya  
7th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
8th Author's Name Masaharu Kobayashi  
8th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
9th Author's Name Eiji Higurashi  
9th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
10th Author's Name Hiroshi Toshiyoshi  
10th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
11th Author's Name Toshiro Hiramoto  
11th Author's Affiliation The University of Tokyo (Univ. of Tokyo)
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Date Time 2019-11-15 14:15:00 
Presentation Time 25 
Registration for ICD 
Paper # IEICE-ICD2019-38,IEICE-IE2019-44 
Volume (vol) IEICE-119 
Number (no) no.284(ICD), no.285(IE) 
Page pp.45-49 
#Pages IEICE-5 
Date of Issue IEICE-ICD-2019-11-07,IEICE-IE-2019-11-07 

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