Paper Abstract and Keywords |
Presentation |
2019-11-08 13:30
[Invited Talk]
Three-dimensional accurate TCAD simulation of trench-gate Si-IGBTs Masahiro Watanabe, Naoyuki Shigyo, Takuya Hoshii, Kazuyoshi Furukawa, Kuniyuki Kakushima (Tokyo Tech.), Katsumi Satoh (Mitsubishi Electric Corp.), Tomoko Matsudai (Toshiba Electronic Devices & Storage Corp.), Takuya Saraya, Toshihiko Takakura, Kazuo Itou, Munetoshi Fukui, Shinichi Suzuki, Kiyoshi Takeuchi (The University of Tokyo), Iriya Muneta, Hitoshi Wakabayashi (Tokyo Tech.), Akira Nakajima (AIST), Shin-ichi Nishizawa (Kyushu University, Kasuga), Kazuo Tsutsui (Tokyo Tech.), Toshiro Hiramoto (The University of Tokyo), Hiromichi Ohashi, Hiroshi Iwai (Tokyo Tech.) SDM2019-77 Link to ES Tech. Rep. Archives: SDM2019-77 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In this work, excellent agreement between 3D TCAD simulations and experimental current-voltage characteristics were obtained in the up to 1000 A/cm$^2$ region for insulated gate bipolar transistors (IGBTs) with scaled trench-gates. The results of 2D and 3D simulations are compared to discuss the difference in current-voltage characteristics and their physical origins. A method to evaluate the saturation current (JCsat) using a 2D simulation is also presented with an appropriate correction. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Silicon Power Device / IGBT / Scaling / TCAD / Simulation / / / |
Reference Info. |
IEICE Tech. Rep., vol. 119, no. 273, SDM2019-77, pp. 45-48, Nov. 2019. |
Paper # |
SDM2019-77 |
Date of Issue |
2019-10-31 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SDM2019-77 Link to ES Tech. Rep. Archives: SDM2019-77 |
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