IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2019-10-25 15:55
Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance
Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi (Tohoku Univ.) EMCJ2019-67 MW2019-96 EST2019-75
Abstract (in Japanese) (See Japanese page) 
(in English) Magnetic composite sheets of ferrite powders were newly packaged between an IC chip and an interposer substrate as a new noise suppressing method to emission noise from RFIC chip. The mitigation level of proposed method was evaluated by wireless communication sensitivity in wireless communication system simulator. The effect depends on materials of magnetic composite sheets. In this paper, BaZn-Y type hexagonal ferrite was introduced, it was better than other three samples. BaZn-Y type hexagonal ferrite mitigated the noise level by 8dB and improved LTE sensitivity by 7dB in 800 MHz band.
Keyword (in Japanese) (See Japanese page) 
(in English) Wireless communication / IC chip packaging / Noise suppression / LTE / Magnetic material / EMC / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 241, EMCJ2019-67, pp. 175-178, Oct. 2019.
Paper # EMCJ2019-67 
Date of Issue 2019-10-17 (EMCJ, MW, EST) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2019-67 MW2019-96 EST2019-75

Conference Information
Committee EMCJ MW EST IEE-EMC  
Conference Date 2019-10-24 - 2019-10-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Gakuin University(Conf. Room 2, Eng. Bldg. 1) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC, Microwave, Electromagnetic field simulation. 
Paper Information
Registration To EMCJ 
Conference Code 2019-10-EMCJ-MW-EST-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Noise Suppression with Magnetic Composite Sheets in IC chip packaging and Improvements of Wireless Communication Performance 
Sub Title (in English)  
Keyword(1) Wireless communication  
Keyword(2) IC chip packaging  
Keyword(3) Noise suppression  
Keyword(4) LTE  
Keyword(5) Magnetic material  
Keyword(6) EMC  
Keyword(7)  
Keyword(8)  
1st Author's Name Koh Watanabe  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Kosuke Jike  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Satoshi Tanaka  
3rd Author's Affiliation Kobe University (Kobe Univ.)
4th Author's Name Noriyuki Miura  
4th Author's Affiliation Kobe University (Kobe Univ.)
5th Author's Name Makoto Nagata  
5th Author's Affiliation Kobe University (Kobe Univ.)
6th Author's Name Akihiro Takahashi  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name Yasunori Miyazawa  
7th Author's Affiliation Tohoku University (Tohoku Univ.)
8th Author's Name Masahiro Yamaguchi  
8th Author's Affiliation Tohoku University (Tohoku Univ.)
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker
Date Time 2019-10-25 15:55:00 
Presentation Time 20 
Registration for EMCJ 
Paper # IEICE-EMCJ2019-67,IEICE-MW2019-96,IEICE-EST2019-75 
Volume (vol) IEICE-119 
Number (no) no.241(EMCJ), no.242(MW), no.243(EST) 
Page pp.175-178 
#Pages IEICE-4 
Date of Issue IEICE-EMCJ-2019-10-17,IEICE-MW-2019-10-17,IEICE-EST-2019-10-17 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan