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Presentation 2019-10-23 14:20
A study on ferroelectric non-doped HfO2 directly deposited on Si(100) substrate by introducing Hf interlayer
Masakazu Kataoka, Masaki Hayashi, Min Gee Kim, Shun-ichiro Ohmi (Tokyo Tech) SDM2019-54 Link to ES Tech. Rep. Archives: SDM2019-54
Abstract (in Japanese) (See Japanese page) 
(in English) In this study, we investigated suppression of SiO2 interfacial layer formation by introducing Hf interlayer to realize the ferroelectric-gate field-effect transistors (FeFET). The HfO2 layer with Hf IL was deposited by RF magnetron sputtering in a reactive sputtering scheme utilizing a Hf target at room temperature. The Ar/O2 flow ratio for reactive sputtering was 2.3/2.5 sccm. PDA was carried out at 600 oC for 30 s in N2 ambient then, Al electrodes were formed. The equivalent oxide thickness (EOT) extracted from C-V characteristics decreased from 8.5 nm to 6.7 nm. However ferroelectric hysteresis was disappeared. Next, the Ar/O2 flow ratio was reduced to 2.3/0.5 sccm and the ferroelectric hysteresis with memory window of 0.27 V was clearly observed even with Hf interlayer. However, stretch was observed in C-V characteristics. To overcome this issue, RF power was decreased from 100 W to 60 W. As a result, memory window was increased from 0.27 V to 0.31 V. In addition, decrease of leakage current and suppression of stretch in C-V characteristics were observed.
Keyword (in Japanese) (See Japanese page) 
(in English) Si / Ferroelectric HfO2 / RF magnetron sputtering / Ar/O2 flow ratio / / / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 239, SDM2019-54, pp. 7-10, Oct. 2019.
Paper # SDM2019-54 
Date of Issue 2019-10-16 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2019-54 Link to ES Tech. Rep. Archives: SDM2019-54

Conference Information
Committee SDM  
Conference Date 2019-10-23 - 2019-10-24 
Place (in Japanese) (See Japanese page) 
Place (in English) Niche, Tohoku Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process Science and New Process Technology 
Paper Information
Registration To SDM 
Conference Code 2019-10-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A study on ferroelectric non-doped HfO2 directly deposited on Si(100) substrate by introducing Hf interlayer 
Sub Title (in English)  
Keyword(1) Si  
Keyword(2) Ferroelectric HfO2  
Keyword(3) RF magnetron sputtering  
Keyword(4) Ar/O2 flow ratio  
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1st Author's Name Masakazu Kataoka  
1st Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
2nd Author's Name Masaki Hayashi  
2nd Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
3rd Author's Name Min Gee Kim  
3rd Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
4th Author's Name Shun-ichiro Ohmi  
4th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
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Speaker Author-1 
Date Time 2019-10-23 14:20:00 
Presentation Time 30 minutes 
Registration for SDM 
Paper # SDM2019-54 
Volume (vol) vol.119 
Number (no) no.239 
Page pp.7-10 
#Pages
Date of Issue 2019-10-16 (SDM) 


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