Paper Abstract and Keywords |
Presentation |
2019-10-23 14:20
A study on ferroelectric non-doped HfO2 directly deposited on Si(100) substrate by introducing Hf interlayer Masakazu Kataoka, Masaki Hayashi, Min Gee Kim, Shun-ichiro Ohmi (Tokyo Tech) SDM2019-54 Link to ES Tech. Rep. Archives: SDM2019-54 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In this study, we investigated suppression of SiO2 interfacial layer formation by introducing Hf interlayer to realize the ferroelectric-gate field-effect transistors (FeFET). The HfO2 layer with Hf IL was deposited by RF magnetron sputtering in a reactive sputtering scheme utilizing a Hf target at room temperature. The Ar/O2 flow ratio for reactive sputtering was 2.3/2.5 sccm. PDA was carried out at 600 oC for 30 s in N2 ambient then, Al electrodes were formed. The equivalent oxide thickness (EOT) extracted from C-V characteristics decreased from 8.5 nm to 6.7 nm. However ferroelectric hysteresis was disappeared. Next, the Ar/O2 flow ratio was reduced to 2.3/0.5 sccm and the ferroelectric hysteresis with memory window of 0.27 V was clearly observed even with Hf interlayer. However, stretch was observed in C-V characteristics. To overcome this issue, RF power was decreased from 100 W to 60 W. As a result, memory window was increased from 0.27 V to 0.31 V. In addition, decrease of leakage current and suppression of stretch in C-V characteristics were observed. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Si / Ferroelectric HfO2 / RF magnetron sputtering / Ar/O2 flow ratio / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 119, no. 239, SDM2019-54, pp. 7-10, Oct. 2019. |
Paper # |
SDM2019-54 |
Date of Issue |
2019-10-16 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SDM2019-54 Link to ES Tech. Rep. Archives: SDM2019-54 |
Conference Information |
Committee |
SDM |
Conference Date |
2019-10-23 - 2019-10-24 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Niche, Tohoku Univ. |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Process Science and New Process Technology |
Paper Information |
Registration To |
SDM |
Conference Code |
2019-10-SDM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
A study on ferroelectric non-doped HfO2 directly deposited on Si(100) substrate by introducing Hf interlayer |
Sub Title (in English) |
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Keyword(1) |
Si |
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Ferroelectric HfO2 |
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RF magnetron sputtering |
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Ar/O2 flow ratio |
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1st Author's Name |
Masakazu Kataoka |
1st Author's Affiliation |
Tokyo Institute of Technology (Tokyo Tech) |
2nd Author's Name |
Masaki Hayashi |
2nd Author's Affiliation |
Tokyo Institute of Technology (Tokyo Tech) |
3rd Author's Name |
Min Gee Kim |
3rd Author's Affiliation |
Tokyo Institute of Technology (Tokyo Tech) |
4th Author's Name |
Shun-ichiro Ohmi |
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Tokyo Institute of Technology (Tokyo Tech) |
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Speaker |
Author-1 |
Date Time |
2019-10-23 14:20:00 |
Presentation Time |
30 minutes |
Registration for |
SDM |
Paper # |
SDM2019-54 |
Volume (vol) |
vol.119 |
Number (no) |
no.239 |
Page |
pp.7-10 |
#Pages |
4 |
Date of Issue |
2019-10-16 (SDM) |
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