Paper Abstract and Keywords |
Presentation |
2019-08-29 13:25
Optical Fiber Array with 90-degree Bend for Silicon Photonics Chip Coupling Tsutaru Kumagai, Tetsuya Nakanishi, Tetsuya Hayashi, Naoki Matsushita, Yuichi Mitose, Kenichiro Takahashi, Manabu Shiozaki, Atsushi Kataoka, Takashi Murakami, Tomomi Sano (SEI) OFT2019-24 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Recently, the demand for silicon photonics (SiPh) optical transceivers for data centers has been increasing rapidly. In order to address this situation, we have developed “Low Profile coupler” (LPC), an optical connection device indispensable for SiPh chips. The LPC is an optical fiber array with an overall height of less than 3.8 mm and with high reliability, formed using state-of-the-art stress-free fiber bending technology. The developed LPC is suitable for use in SiPh optical transceivers because of its compact nature with and low attenuation loss of less than 0.5 dB. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
space-efficient optical fiber array / silicon photonics / optical interconnection device / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 119, no. 187, OFT2019-24, pp. 1-5, Aug. 2019. |
Paper # |
OFT2019-24 |
Date of Issue |
2019-08-22 (OFT) |
ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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OFT2019-24 |
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