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Paper Abstract and Keywords
Presentation 2018-12-06 17:10
Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits
LIU BAI (Tokyo Tech), Takehiko Kikuchi (SEI), Takuya Mitarai, Nobuhiko Nishiyama (Tokyo Tech), Hideki Yagi (SEI), Tomohiro Amemiya, Shigehisa Arai (Tokyo Tech) OPE2018-127 LQE2018-137 SIPH2018-43
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) Hybrid / Photonic Integrated Circuits / Chip-on-Wafer / Plasma Activated Bonding / photoluminescence / stress / /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 348, OPE2018-127, pp. 149-153, Dec. 2018.
Paper # OPE2018-127 
Date of Issue 2018-11-29 (OPE, LQE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF OPE2018-127 LQE2018-137 SIPH2018-43

Conference Information
Committee LQE OPE SIPH  
Conference Date 2018-12-06 - 2018-12-07 
Place (in Japanese) (See Japanese page) 
Place (in English) Keio University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photonic Device Workshop 
Paper Information
Registration To OPE 
Conference Code 2018-12-LQE-OPE-SIPH 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits 
Sub Title (in English)  
Keyword(1) Hybrid  
Keyword(2) Photonic Integrated Circuits  
Keyword(3) Chip-on-Wafer  
Keyword(4) Plasma Activated Bonding  
Keyword(5) photoluminescence  
Keyword(6) stress  
Keyword(7)  
Keyword(8)  
1st Author's Name LIU BAI  
1st Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
2nd Author's Name Takehiko Kikuchi  
2nd Author's Affiliation Sumitomo Electric Industries, Ltd (SEI)
3rd Author's Name Takuya Mitarai  
3rd Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
4th Author's Name Nobuhiko Nishiyama  
4th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
5th Author's Name Hideki Yagi  
5th Author's Affiliation Sumitomo Electric Industries, Ltd (SEI)
6th Author's Name Tomohiro Amemiya  
6th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
7th Author's Name Shigehisa Arai  
7th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
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Speaker
Date Time 2018-12-06 17:10:00 
Presentation Time 80 
Registration for OPE 
Paper # IEICE-OPE2018-127,IEICE-LQE2018-137,IEICE-SIPH2018-43 
Volume (vol) IEICE-118 
Number (no) no.348(OPE), no.349(LQE) 
Page pp.149-153 
#Pages IEICE-5 
Date of Issue IEICE-OPE-2018-11-29,IEICE-LQE-2018-11-29 


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