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| Presentation | 2018-12-06 17:10 Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits LIU BAI (Tokyo Tech), Takehiko Kikuchi (SEI), Takuya Mitarai, Nobuhiko Nishiyama (Tokyo Tech), Hideki Yagi (SEI), Tomohiro Amemiya, Shigehisa Arai (Tokyo Tech)  OPE2018-127 LQE2018-137 SIPH2018-43 Link to ES Tech. Rep. Archives: OPE2018-127 LQE2018-137 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | (Not available yet) | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Hybrid / Photonic Integrated Circuits / Chip-on-Wafer / Plasma Activated Bonding / photoluminescence / stress / / | |
| Reference Info. | IEICE Tech. Rep., vol. 118, no. 348, OPE2018-127, pp. 149-153, Dec. 2018. | |
| Paper # | OPE2018-127 | |
| Date of Issue | 2018-11-29 (OPE, LQE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | OPE2018-127 LQE2018-137 SIPH2018-43 Link to ES Tech. Rep. Archives: OPE2018-127 LQE2018-137 |
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| Conference Information | |
| Committee | LQE OPE SIPH |
| Conference Date | 2018-12-06 - 2018-12-07 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Keio University |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Photonic Device Workshop |
| Paper Information | |
| Registration To | OPE |
| Conference Code | 2018-12-LQE-OPE-SIPH |
| Language | English (Japanese title is available) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits |
| Sub Title (in English) | |
| Keyword(1) | Hybrid |
| Keyword(2) | Photonic Integrated Circuits |
| Keyword(3) | Chip-on-Wafer |
| Keyword(4) | Plasma Activated Bonding |
| Keyword(5) | photoluminescence |
| Keyword(6) | stress |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | LIU BAI |
| 1st Author's Affiliation | Tokyo Institute of Technology (Tokyo Tech) |
| 2nd Author's Name | Takehiko Kikuchi |
| 2nd Author's Affiliation | Sumitomo Electric Industries, Ltd (SEI) |
| 3rd Author's Name | Takuya Mitarai |
| 3rd Author's Affiliation | Tokyo Institute of Technology (Tokyo Tech) |
| 4th Author's Name | Nobuhiko Nishiyama |
| 4th Author's Affiliation | Tokyo Institute of Technology (Tokyo Tech) |
| 5th Author's Name | Hideki Yagi |
| 5th Author's Affiliation | Sumitomo Electric Industries, Ltd (SEI) |
| 6th Author's Name | Tomohiro Amemiya |
| 6th Author's Affiliation | Tokyo Institute of Technology (Tokyo Tech) |
| 7th Author's Name | Shigehisa Arai |
| 7th Author's Affiliation | Tokyo Institute of Technology (Tokyo Tech) |
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| Speaker | Author-1 |
| Date Time | 2018-12-06 17:10:00 |
| Presentation Time | 80 minutes |
| Registration for | OPE |
| Paper # | OPE2018-127, LQE2018-137, SIPH2018-43 |
| Volume (vol) | vol.118 |
| Number (no) | no.348(OPE), no.349(LQE) |
| Page | pp.149-153 |
| #Pages | 5 |
| Date of Issue | 2018-11-29 (OPE, LQE) |
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