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Paper Abstract and Keywords
Presentation 2018-11-08 13:30
[Invited Talk] Device Simulation of Reliability for Advanced Semiconductor Devices
Takamitsu Ishihara, Kazuya Matsuzawa, Takeshi Naito, Sadayuki Yoshitomi (TMC) SDM2018-67 Link to ES Tech. Rep. Archives: SDM2018-67
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 291, SDM2018-67, pp. 17-22, Nov. 2018.
Paper # SDM2018-67 
Date of Issue 2018-11-01 (SDM) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2018-67 Link to ES Tech. Rep. Archives: SDM2018-67

Conference Information
Committee SDM  
Conference Date 2018-11-08 - 2018-11-09 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process, Device, Circuit simulation, etc. 
Paper Information
Registration To SDM 
Conference Code 2018-11-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Device Simulation of Reliability for Advanced Semiconductor Devices 
Sub Title (in English)  
1st Author's Name Takamitsu Ishihara  
1st Author's Affiliation Toshiba Memory Corporation (TMC)
2nd Author's Name Kazuya Matsuzawa  
2nd Author's Affiliation Toshiba Memory Corporation (TMC)
3rd Author's Name Takeshi Naito  
3rd Author's Affiliation Toshiba Memory Corporation (TMC)
4th Author's Name Sadayuki Yoshitomi  
4th Author's Affiliation Toshiba Memory Corporation (TMC)
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Date Time 2018-11-08 13:30:00 
Presentation Time 60 
Registration for SDM 
Paper # IEICE-SDM2018-67 
Volume (vol) IEICE-118 
Number (no) no.291 
Page pp.17-22 
#Pages IEICE-6 
Date of Issue IEICE-SDM-2018-11-01 

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