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Presentation 2018-07-12 14:20
Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform
Takeshi Matsumoto, Teruo Kurahashi (Fujitsu Lab), Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa (AIST), Ayahito Uetake, Kazumasa Takabayashi (Fujitsu Lab), Kazuhiro Ikeda, Hitoshi Kawashima (AIST), Suguru Akiyama, Shigeaki Sekiguchi (Fujitsu Lab) LQE2018-23 Link to ES Tech. Rep. Archives: LQE2018-23
Abstract (in Japanese) (See Japanese page) 
(in English) We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for optical loss compensation of large-scale Si optical switches which are key devices in optical pass networks. For efficient coupling and large alignment tolerance, we adopted width-tapered spot-size converters (SSCs) on SOAs. On Si optical platforms, we used SiON dual-core SSCs for the coupling to SOAs. We developed precise flip-chip bonding (FCB) technologies of SOAs on Si optical platforms within 1-um alignment accuracy, and achieved in-line optical amplification of 15 dB and loss-less operation of 4x4 Si optical switches with SOA.
Keyword (in Japanese) (See Japanese page) 
(in English) Silicon Photonics / Hybrid Integration / Flip-Chip Bonding / Silicon Optical Switch / / / /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 129, LQE2018-23, pp. 13-16, July 2018.
Paper # LQE2018-23 
Date of Issue 2018-07-05 (LQE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF LQE2018-23 Link to ES Tech. Rep. Archives: LQE2018-23

Conference Information
Committee LQE  
Conference Date 2018-07-12 - 2018-07-13 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To LQE 
Conference Code 2018-07-LQE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform 
Sub Title (in English)  
Keyword(1) Silicon Photonics  
Keyword(2) Hybrid Integration  
Keyword(3) Flip-Chip Bonding  
Keyword(4) Silicon Optical Switch  
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Keyword(6)  
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1st Author's Name Takeshi Matsumoto  
1st Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
2nd Author's Name Teruo Kurahashi  
2nd Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
3rd Author's Name Ryotaro Konoike  
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
4th Author's Name Keijiro Suzuki  
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Ken Tanizawa  
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Ayahito Uetake  
6th Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
7th Author's Name Kazumasa Takabayashi  
7th Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
8th Author's Name Kazuhiro Ikeda  
8th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
9th Author's Name Hitoshi Kawashima  
9th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
10th Author's Name Suguru Akiyama  
10th Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
11th Author's Name Shigeaki Sekiguchi  
11th Author's Affiliation Fujitsu Laboratories Ltd. (Fujitsu Lab)
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Speaker
Date Time 2018-07-12 14:20:00 
Presentation Time 25 
Registration for LQE 
Paper # IEICE-LQE2018-23 
Volume (vol) IEICE-118 
Number (no) no.129 
Page pp.13-16 
#Pages IEICE-4 
Date of Issue IEICE-LQE-2018-07-05 


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