Paper Abstract and Keywords |
Presentation |
2018-07-12 15:00
[Invited Talk]
What will be a compelling technology for beyond-400 Gbps systems; Devices vs. Packaging
-- Assembly Techniques to Realize Integrated Transmitter Optical Modules for Today's and Tomorrow's Large Capacity Application -- Keita Mochizuki (Mitsubishi Electric Corp.) LQE2018-24 Link to ES Tech. Rep. Archives: LQE2018-24 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The rapid growth of data traffic requires high capacity optical transmission systems. To meet this demand, the baud rate, numbers of multi-level and wavelength multiplexing are increasing. The intensity modulation / direct detection (IMDD) method which can easily construct the system is used in the short reach applications. For 10 km reach system, 100 Gb/s is realized by 25 Gbaud NRZ 4-wavelength multiplexing and one of the most promising 400 Gb/s is realized by 56 Gbaud PAM4 4-wavelength multiplexing. We developed the precise lens-assembly techniques based on the adhesive bonding and hammering. These techniques allow us to realize a compact TOSA which is suitable for the QSFP28 form factor.
On the other hand, with the beyond 400 Gb/s scheme, the transmission distance which is applicable to the IMDD system is shortened due to the penalty increase, and the digital coherent system is used. The one of the issues when introducing the digital coherent system into a short range system is cost reduction. It is necessary to realize a high baud rate of 100 Gbaud, a narrow linewidth and high light output with low cost. In this presentation, we discuss the technologies that should be. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
100Gb/s / 400Gb/s / 800Gb/s / TOSA / Lens assembly technology / / / |
Reference Info. |
IEICE Tech. Rep., vol. 118, no. 129, LQE2018-24, pp. 17-20, July 2018. |
Paper # |
LQE2018-24 |
Date of Issue |
2018-07-05 (LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
LQE2018-24 Link to ES Tech. Rep. Archives: LQE2018-24 |
Conference Information |
Committee |
LQE |
Conference Date |
2018-07-12 - 2018-07-13 |
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(See Japanese page) |
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Registration To |
LQE |
Conference Code |
2018-07-LQE |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
What will be a compelling technology for beyond-400 Gbps systems; Devices vs. Packaging |
Sub Title (in English) |
Assembly Techniques to Realize Integrated Transmitter Optical Modules for Today's and Tomorrow's Large Capacity Application |
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100Gb/s |
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400Gb/s |
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800Gb/s |
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TOSA |
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Lens assembly technology |
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Keita Mochizuki |
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Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
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Speaker |
Author-1 |
Date Time |
2018-07-12 15:00:00 |
Presentation Time |
15 minutes |
Registration for |
LQE |
Paper # |
LQE2018-24 |
Volume (vol) |
vol.118 |
Number (no) |
no.129 |
Page |
pp.17-20 |
#Pages |
4 |
Date of Issue |
2018-07-05 (LQE) |
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