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| Presentation | 2018-07-12 15:15 [Invited Talk] What will be a compelling technology for beyond-400 G systems; Devices vs. Packaging -- Laser chips used in Intra- and inter- Data Centers -- Toshimitsu Kaneko (SUMITOMO ELECTRIC)  LQE2018-25 Link to ES Tech. Rep. Archives: LQE2018-25 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | 400G is now a hot topic in high speed optical fiber communications behind increasing data traffic especially around Datacenters(DCs). There are two activities by reaches. The shorter length system is often called 400GbE, scandalized in IEEE802.3bs, and already some transceiver vendors carried out its demonstration at Optical Fiber Conference (OFC) in March this year. The transceiver (QSFP-DD) comprises 4 carriers of each 53GBd-PAM4 modulation format. Electro-absorption(EA) modulated DFB lasers (EMLs) are expected to employ for 2km transmission transceiver otherwise SiPh is considered for 500m-solutions. Both technologies share difficulties for high speed signal transmission and high density packaging while keeping their product costs. The letter activity for inter-DC communications is 400ZR, which is discussed in Optical Internetworking Forum (OIF). The expected format is a coherent 64GBd PDM-16QAM. A OSFP or QSFP-DD is considered as its form factor. For the purpose, a high output power-, narrow linewidth- and less than 2W power consumption- tunable laser is required. We also refer to “beyond 400G”. Subjects of laser chip for future higher lane density-, higher baud rate- or higher modulation format-optical communications are discussed. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 400G / 400ZR / EML / coherent / TDA-CSG / tunable / / | |
| Reference Info. | IEICE Tech. Rep., vol. 118, no. 129, LQE2018-25, pp. 21-24, July 2018. | |
| Paper # | LQE2018-25 | |
| Date of Issue | 2018-07-05 (LQE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | LQE2018-25 Link to ES Tech. Rep. Archives: LQE2018-25 |
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| Conference Information | |
| Committee | LQE |
| Conference Date | 2018-07-12 - 2018-07-13 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | LQE |
| Conference Code | 2018-07-LQE |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | What will be a compelling technology for beyond-400 G systems; Devices vs. Packaging |
| Sub Title (in English) | Laser chips used in Intra- and inter- Data Centers |
| Keyword(1) | 400G |
| Keyword(2) | 400ZR |
| Keyword(3) | EML |
| Keyword(4) | coherent |
| Keyword(5) | TDA-CSG |
| Keyword(6) | tunable |
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| Keyword(8) | |
| 1st Author's Name | Toshimitsu Kaneko |
| 1st Author's Affiliation | SUMITOMO ELECTRIC INDUSTRIES,LTD. (SUMITOMO ELECTRIC) |
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| Speaker | Author-1 |
| Date Time | 2018-07-12 15:15:00 |
| Presentation Time | 15 minutes |
| Registration for | LQE |
| Paper # | LQE2018-25 |
| Volume (vol) | vol.118 |
| Number (no) | no.129 |
| Page | pp.21-24 |
| #Pages | 4 |
| Date of Issue | 2018-07-05 (LQE) |
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