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Paper Abstract and Keywords
Presentation 2018-05-25 13:25
Comparison of GaInAsP laser diode between hydrophilic bonded InP/Si substrate and InP substrate
Hiromu Yada, Kazuki Uchida, Hirokazu Sugiyama, Periyanayagam Gandhi Kallarasan, Xu Han, Masaki Aikawa, Natsuki Hayasaka, Kazuhiko Shimomura (Sophia Univ.) LQE2018-16 Link to ES Tech. Rep. Archives: LQE2018-16
Abstract (in Japanese) (See Japanese page) 
(in English) We have proposed monolithic integration of optical device on hydrophilic bonded InP/Si substrate via MOVPE. We have fabricated 1.5 µm GaInAsP broad and stripe laser diode on InP/Si substrate. In this report, we describe mainly comparison of lasing characteristics between hydrophilic bonded InP/Si substrate and InP substrate.
Keyword (in Japanese) (See Japanese page) 
(in English) InP / Si / direct wafer bonding / MOVPE / integration / optical device / semiconductor laser /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 62, LQE2018-16, pp. 25-28, May 2018.
Paper # LQE2018-16 
Date of Issue 2018-05-17 (LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF LQE2018-16 Link to ES Tech. Rep. Archives: LQE2018-16

Conference Information
Committee LQE LSJ  
Conference Date 2018-05-24 - 2018-05-25 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To LQE 
Conference Code 2018-05-LQE-LSJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Comparison of GaInAsP laser diode between hydrophilic bonded InP/Si substrate and InP substrate 
Sub Title (in English)  
Keyword(1) InP  
Keyword(2) Si  
Keyword(3) direct wafer bonding  
Keyword(4) MOVPE  
Keyword(5) integration  
Keyword(6) optical device  
Keyword(7) semiconductor laser  
Keyword(8)  
1st Author's Name Hiromu Yada  
1st Author's Affiliation Sophia University (Sophia Univ.)
2nd Author's Name Kazuki Uchida  
2nd Author's Affiliation Sophia University (Sophia Univ.)
3rd Author's Name Hirokazu Sugiyama  
3rd Author's Affiliation Sophia University (Sophia Univ.)
4th Author's Name Periyanayagam Gandhi Kallarasan  
4th Author's Affiliation Sophia University (Sophia Univ.)
5th Author's Name Xu Han  
5th Author's Affiliation Sophia University (Sophia Univ.)
6th Author's Name Masaki Aikawa  
6th Author's Affiliation Sophia University (Sophia Univ.)
7th Author's Name Natsuki Hayasaka  
7th Author's Affiliation Sophia University (Sophia Univ.)
8th Author's Name Kazuhiko Shimomura  
8th Author's Affiliation Sophia University (Sophia Univ.)
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Speaker Author-1 
Date Time 2018-05-25 13:25:00 
Presentation Time 25 minutes 
Registration for LQE 
Paper # LQE2018-16 
Volume (vol) vol.118 
Number (no) no.62 
Page pp.25-28 
#Pages
Date of Issue 2018-05-17 (LQE) 


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