Paper Abstract and Keywords |
Presentation |
2018-05-25 13:25
Comparison of GaInAsP laser diode between hydrophilic bonded InP/Si substrate and InP substrate Hiromu Yada, Kazuki Uchida, Hirokazu Sugiyama, Periyanayagam Gandhi Kallarasan, Xu Han, Masaki Aikawa, Natsuki Hayasaka, Kazuhiko Shimomura (Sophia Univ.) LQE2018-16 Link to ES Tech. Rep. Archives: LQE2018-16 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We have proposed monolithic integration of optical device on hydrophilic bonded InP/Si substrate via MOVPE. We have fabricated 1.5 µm GaInAsP broad and stripe laser diode on InP/Si substrate. In this report, we describe mainly comparison of lasing characteristics between hydrophilic bonded InP/Si substrate and InP substrate. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
InP / Si / direct wafer bonding / MOVPE / integration / optical device / semiconductor laser / |
Reference Info. |
IEICE Tech. Rep., vol. 118, no. 62, LQE2018-16, pp. 25-28, May 2018. |
Paper # |
LQE2018-16 |
Date of Issue |
2018-05-17 (LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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Download PDF |
LQE2018-16 Link to ES Tech. Rep. Archives: LQE2018-16 |