講演抄録/キーワード |
講演名 |
2017-05-19 13:20
[招待講演]2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics ○En-Xiao Liu・Siping Gao・Hui Min Lee(A*STAR IHPC) EMCJ2017-19 |
抄録 |
(和) |
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design.
This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results. |
(英) |
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential design consideration for modern high-speed electronics. Relentless increase in the operation frequency, and high integrated co-existence of analogue, digital and RF components are only making the situation worse. Besides experiments and testing, modeling and simulation plays an indispensible role in modern high speed electronic design.
This talk will first present a survey of 2.5D methodologies, which are based on modal decomposition principle, for efficient modeling of electronic packages and multilayer printed circuit boards (PCB). It then reports the latest development of 2D discontinuous Galerkin method (2D DGTD) based 2.5D methodology for analysis of signal and power integrity in multilayer PCBs. Moreover, the recent study of handling narrow slots in the power-ground planes by a hybrid 1D- and 2D- DGTD method is also presented. Numerical examples are given with simulation results compared against measurement as well as full-wave simulation results. |
キーワード |
(和) |
modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD / / |
(英) |
modeling and simulation / signal integrity / power integrity / modal decomposition / 2.5D method / DGTD / / |
文献情報 |
信学技報, vol. 117, no. 32, EMCJ2017-19, pp. 67-67, 2017年5月. |
資料番号 |
EMCJ2017-19 |
発行日 |
2017-05-11 (EMCJ) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
査読に ついて |
本技術報告は査読を経ていない技術報告であり,推敲を加えられていずれかの場に発表されることがあります. |
PDFダウンロード |
EMCJ2017-19 |
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