IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-03-01 12:40
[Poster Presentation] Application and Evaluation of CIP Methods to Acoustic Wave Propagation Analysis with Multi-dimensional Advection
Akihiro Fukuda, Kan Okubo (Tokyo Met. Univ.), Takuya Oshima (Niigata Univ.), Takao Tsuchiya (Doshisha Univ.), Masashi Kanamori (JAXA)
Abstract (in Japanese) (See Japanese page) 
(in English) The constrained interpolation profile (CIP) method is a calculation method with less numerical dispersion error, which uses the values of acoustic field and their spatial derivatives at grid points to solve the problem of
wave propagation. In the study, we investigate the type-C CIP and type-M CIP methods as a method considering the background flow in the acoustic field. The difference between the type-M and type-C CIP methods is the
handling of a second-order special derivative. The type-M CIP method uses the linear interpolation to calculate the advection of the perpendicular derivatives. The type-M CIP method is a simple technique with smaller memory use and less calculation time required than the type-C CIP method. Then, the calculation results are evaluated and compared with those by the exact solution and the linearized Euler equation method.
Keyword (in Japanese) (See Japanese page) 
(in English) constrained interpolation profile (CIP) method / method of characteristics / background flow / acoustic wave propagation / type-M CIP method / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 475, EA2016-90, pp. 49-54, March 2017.
Paper # EA2016-90 
Date of Issue 2017-02-22 (EA, SIP, SP) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380

Conference Information
Committee SP SIP EA  
Conference Date 2017-03-01 - 2017-03-02 
Place (in Japanese) (See Japanese page) 
Place (in English) Okinawa Industry Support Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Speech, Engineering/Electro Acoustics, Signal Processing, and Related Topics 
Paper Information
Registration To EA 
Conference Code 2017-03-SP-SIP-EA 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Application and Evaluation of CIP Methods to Acoustic Wave Propagation Analysis with Multi-dimensional Advection 
Sub Title (in English)  
Keyword(1) constrained interpolation profile (CIP) method  
Keyword(2) method of characteristics  
Keyword(3) background flow  
Keyword(4) acoustic wave propagation  
Keyword(5) type-M CIP method  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Akihiro Fukuda  
1st Author's Affiliation Tokyo Metropolitan University (Tokyo Met. Univ.)
2nd Author's Name Kan Okubo  
2nd Author's Affiliation Tokyo Metropolitan University (Tokyo Met. Univ.)
3rd Author's Name Takuya Oshima  
3rd Author's Affiliation Niigata University (Niigata Univ.)
4th Author's Name Takao Tsuchiya  
4th Author's Affiliation Doshisha University (Doshisha Univ.)
5th Author's Name Masashi Kanamori  
5th Author's Affiliation Japan Aerospace eXploration Agency (JAXA)
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker
Date Time 2017-03-01 12:40:00 
Presentation Time 90 
Registration for EA 
Paper # IEICE-EA2016-90,IEICE-SIP2016-145,IEICE-SP2016-85 
Volume (vol) IEICE-116 
Number (no) no.475(EA), no.476(SIP), no.477(SP) 
Page pp.49-54 
#Pages IEICE-6 
Date of Issue IEICE-EA-2017-02-22,IEICE-SIP-2017-02-22,IEICE-SP-2017-02-22 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan