IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-02-17 17:00
Report on thermal simulation technique to analyze effect of contact bounce arc.
Kazua Murakami, Takeshi Nishida (Omron), Tetsuo Shinkai (OER) R2016-71 EMD2016-98 Link to ES Tech. Rep. Archives: EMD2016-98
Abstract (in Japanese) (See Japanese page) 
(in English) We report a thermal analysis method to quantify the melting phenomenon of the contact which causes the contact welding phenomenon of the relay. Melting phenomenon of the contact occurs due to energy being supplied to the contact by the motion bounce arc. At this time, it was found that when the energy of the arc is continued to be given at one point, the analysis result becomes a melting state different from the actual measurement. In this report, the results of thermal analysis are compared with the actual measurement result of the contact melting area by the same arc energy, and the way of giving the arc energy to reproduce the actual measurement is verified. As a result, it was found that the arc energy does not continue to be given at one point, but arc melts the contact while moving on the contact surface.
Keyword (in Japanese) (See Japanese page) 
(in English) Contact / Thermal / Melting Contact / Simulation / / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 459, EMD2016-98, pp. 65-70, Feb. 2017.
Paper # EMD2016-98 
Date of Issue 2017-02-10 (R, EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2016-71 EMD2016-98 Link to ES Tech. Rep. Archives: EMD2016-98

Conference Information
Committee EMD R  
Conference Date 2017-02-17 - 2017-02-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Omuron Kusatsu Factory 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2017-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Report on thermal simulation technique to analyze effect of contact bounce arc. 
Sub Title (in English)  
Keyword(1) Contact  
Keyword(2) Thermal  
Keyword(3) Melting Contact  
Keyword(4) Simulation  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Kazua Murakami  
1st Author's Affiliation Omron Corporation (Omron)
2nd Author's Name Takeshi Nishida  
2nd Author's Affiliation Omron Corporation (Omron)
3rd Author's Name Tetsuo Shinkai  
3rd Author's Affiliation Omron Relay And Device Corporation (OER)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2017-02-17 17:00:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # R2016-71, EMD2016-98 
Volume (vol) vol.116 
Number (no) no.458(R), no.459(EMD) 
Page pp.65-70 
#Pages
Date of Issue 2017-02-10 (R, EMD) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan