Paper Abstract and Keywords |
Presentation |
2017-02-06 13:35
[Invited Talk]
Electrical coupling of stacked transistors in monolithic three-dimensional inverters and its dependence on the interlayer dielectric thickness Junichi Hattori, Koichi Fukuda, Toshifumi Irisawa, Hiroyuki Ota, Tatsuro Maeda (AIST) SDM2016-143 Link to ES Tech. Rep. Archives: SDM2016-143 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We study the electrical coupling of stacked transistors in monolithic three-dimensional (3D) inverters and investigate its effect on the performance of 3D inverters using technology computer-aided design simulation. The electrical coupling improves the current driving capability of the top transistors. Owing to this improvement, 3D inverters have a smaller intrinsic delay than the corresponding two-dimensional (2D) inverters although their switching energy is comparable to that of the 2D inverters. We analyze the relationship of such electrical coupling effects with the interlayer dielectric (ILD) thickness and find that there exists an optimal ILD thickness that maximizes 3D inverters' performance. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
3-D integrated circuit / CMOS inverter / stacked transistor / interlayer coupling / TCAD / / / |
Reference Info. |
IEICE Tech. Rep., vol. 116, no. 450, SDM2016-143, pp. 23-28, Feb. 2017. |
Paper # |
SDM2016-143 |
Date of Issue |
2017-01-30 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
SDM2016-143 Link to ES Tech. Rep. Archives: SDM2016-143 |