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Paper Abstract and Keywords
Presentation 2016-11-25 10:30
Radiated Emission Analysis with Electromagnetic Simulation for Printed Circuit Boards
Kodai Katagiri, Norihiko Akashi, Sotome Hideyuki, Takaya Muto (Mitsubishi Electric Corp.) EMCJ2016-89
Abstract (in Japanese) (See Japanese page) 
(in English) It is necessary to design printed circuit boards of the electronic equipment in consideration of restraining radiated emission. Therefore, it becomes more and more difficult for securing EMC quality because of increasing the number of noise sources by downsizing and high functionality, high speed communication clock and semiconductor switching, and non-shielded housing for heat radiation. This paper studied voltage distribution in GND layer which is caused by plural noise sources in printed circuit board using quasi-three-dimensional electromagnetic simulations. We made clear the mechanism of the noise propagation, and found that radiated emission can reduce maximum 17 dB by fixed wiring pattern and noise filter layout.
Keyword (in Japanese) (See Japanese page) 
(in English) EMC / Printed Circuit Board / Radiated Emission / Electromagnetic Simulation / / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 327, EMCJ2016-89, pp. 7-11, Nov. 2016.
Paper # EMCJ2016-89 
Date of Issue 2016-11-18 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMCJ  
Conference Date 2016-11-25 - 2016-11-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Young Scientist Meeting 
Paper Information
Registration To EMCJ 
Conference Code 2016-11-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Radiated Emission Analysis with Electromagnetic Simulation for Printed Circuit Boards 
Sub Title (in English)  
Keyword(1) EMC  
Keyword(2) Printed Circuit Board  
Keyword(3) Radiated Emission  
Keyword(4) Electromagnetic Simulation  
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1st Author's Name Kodai Katagiri  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
2nd Author's Name Norihiko Akashi  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
3rd Author's Name Sotome Hideyuki  
3rd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
4th Author's Name Takaya Muto  
4th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
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Speaker Author-1 
Date Time 2016-11-25 10:30:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2016-89 
Volume (vol) vol.116 
Number (no) no.327 
Page pp.7-11 
#Pages
Date of Issue 2016-11-18 (EMCJ) 


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