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Paper Abstract and Keywords
Presentation 2016-05-13 14:50
A study on influence of interconnect inductance of a SiC power module on transient characteristic
Eisuke Masuda, Takaaki Ibuchi, Tsuyoshi Funaki (Osaka Univ.), Hirotaka Otake, Tatsuya Miyazaki, Yasuo Kanetake, Takashi Nakamura (ROHM) EMCJ2016-15
Abstract (in Japanese) (See Japanese page) 
(in English) Fast switching operation using wide-bandgap power semiconductor devices is expected to reduce the switching loss in a converter. However, large $di/dt$ and $dv/dt$ also lead to surge and EMI(Electro-Magnetic Interference) noise by interacting with circuit parasitic inductance. It is necessary to model parasitic component in circuit or element, and to estimate their influence on transient characteristics of power devices. This report models interconnect inductance of SiC power module using Partial Element Equivalent Circuit method and evaluates its influence on transient characteristic in a DC/DC buck converter. This work also studies the effect of a snubber capacitor on the suppression of surge voltage.
Keyword (in Japanese) (See Japanese page) 
(in English) Surge / EMI / Parasitic inductance / Partial Element Equivalent Circuit method / Snubber capasitor / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 26, EMCJ2016-15, pp. 35-40, May 2016.
Paper # EMCJ2016-15 
Date of Issue 2016-05-06 (EMCJ) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMCJ  
Conference Date 2016-05-13 - 2016-05-13 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkaido University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Power Electronics, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2016-05-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A study on influence of interconnect inductance of a SiC power module on transient characteristic 
Sub Title (in English)  
Keyword(1) Surge  
Keyword(2) EMI  
Keyword(3) Parasitic inductance  
Keyword(4) Partial Element Equivalent Circuit method  
Keyword(5) Snubber capasitor  
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Keyword(7)  
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1st Author's Name Eisuke Masuda  
1st Author's Affiliation Osaka University (Osaka Univ.)
2nd Author's Name Takaaki Ibuchi  
2nd Author's Affiliation Osaka University (Osaka Univ.)
3rd Author's Name Tsuyoshi Funaki  
3rd Author's Affiliation Osaka University (Osaka Univ.)
4th Author's Name Hirotaka Otake  
4th Author's Affiliation ROHM Co., Ltd. (ROHM)
5th Author's Name Tatsuya Miyazaki  
5th Author's Affiliation ROHM Co., Ltd. (ROHM)
6th Author's Name Yasuo Kanetake  
6th Author's Affiliation ROHM Co., Ltd. (ROHM)
7th Author's Name Takashi Nakamura  
7th Author's Affiliation ROHM Co., Ltd. (ROHM)
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Speaker
Date Time 2016-05-13 14:50:00 
Presentation Time 25 
Registration for EMCJ 
Paper # IEICE-EMCJ2016-15 
Volume (vol) IEICE-116 
Number (no) no.26 
Page pp.35-40 
#Pages IEICE-6 
Date of Issue IEICE-EMCJ-2016-05-06 


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