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| Presentation | 2016-01-22 10:05 [Invited Talk] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus)  SDM2015-108 Link to ES Tech. Rep. Archives: SDM2015-108 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | We evaluated the reliability of 3D stacked CMOS image sensors (CISs) with 4 million micro bump inter-connections at a 7.6-um pitch bonded with wafer bonding technology. This 3D stacked technology was proved to have no negative effect on CIS characteristics and to provide a high density and narrow pitched in-pixel connection with high reliability, no defects, and no deteriorations over a 1000-cycle heat cycle test and 1000-hour high temperature and high humidity test. This CIS sensor has a set of readout circuits in each substrate, which enable us to detect any connection failure among 4 million micro bumps between substrates individually. These results show that this 3D technology has enough reliability for application to products. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | CMOS Image Sensor / 3D Stacked structure / Micro-Bump / Reliability / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 115, no. 417, SDM2015-108, pp. 1-4, Jan. 2016. | |
| Paper # | SDM2015-108 | |
| Date of Issue | 2016-01-15 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2015-108 Link to ES Tech. Rep. Archives: SDM2015-108 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2016-01-22 - 2016-01-22 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Sanjo Conference Hall, The University of Tokyo |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Interconnects, Package and related materials |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2016-01-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor |
| Sub Title (in English) | |
| Keyword(1) | CMOS Image Sensor |
| Keyword(2) | 3D Stacked structure |
| Keyword(3) | Micro-Bump |
| Keyword(4) | Reliability |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Yoshiaki Takemoto |
| 1st Author's Affiliation | Olympus Corporation (Olympus) |
| 2nd Author's Name | Naohiro Takazawa |
| 2nd Author's Affiliation | Olympus Corporation (Olympus) |
| 3rd Author's Name | Mitsuhiro Tsukimura |
| 3rd Author's Affiliation | Olympus Corporation (Olympus) |
| 4th Author's Name | Haruhisa Saito |
| 4th Author's Affiliation | Olympus Corporation (Olympus) |
| 5th Author's Name | Toru Kondo |
| 5th Author's Affiliation | Olympus Corporation (Olympus) |
| 6th Author's Name | Hideki Kato |
| 6th Author's Affiliation | Olympus Corporation (Olympus) |
| 7th Author's Name | Jun Aoki |
| 7th Author's Affiliation | Olympus Corporation (Olympus) |
| 8th Author's Name | Kenji Kobayashi |
| 8th Author's Affiliation | Olympus Corporation (Olympus) |
| 9th Author's Name | Shunsuke Suzuki |
| 9th Author's Affiliation | Olympus Corporation (Olympus) |
| 10th Author's Name | Yuichi Gomi |
| 10th Author's Affiliation | Olympus Corporation (Olympus) |
| 11th Author's Name | Seisuke Matsuda |
| 11th Author's Affiliation | Olympus Corporation (Olympus) |
| 12th Author's Name | Yoshitaka Tadaki |
| 12th Author's Affiliation | Olympus Corporation (Olympus) |
| 13th Author's Name | |
| 13th Author's Affiliation | () |
| 14th Author's Name | |
| 14th Author's Affiliation | () |
| 15th Author's Name | |
| 15th Author's Affiliation | () |
| 16th Author's Name | |
| 16th Author's Affiliation | () |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-1 |
| Date Time | 2016-01-22 10:05:00 |
| Presentation Time | 35 minutes |
| Registration for | SDM |
| Paper # | SDM2015-108 |
| Volume (vol) | vol.115 |
| Number (no) | no.417 |
| Page | pp.1-4 |
| #Pages | 4 |
| Date of Issue | 2016-01-15 (SDM) |
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