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Paper Abstract and Keywords
Presentation 2015-12-03 10:50
[Invited Talk] Development of Via Structures in IC Package Substrates for Impedance Reduction
Tomoyuki Akaboshi, Taiga Fukumori, Daisuke Mizutani, Motoaki Tani (Fujitsu Lab.) Link to ES Tech. Rep. Archives: CPM2015-136 ICD2015-61
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes the impedance reduction technologies in build-up package substrates for high performance CPU, such as enterprise servers or super computers. The layer connection structures of the power supply path were improved by changing a via formation in build-up substrate. As a result, we have found a via structure that improves the electrical characteristics while also yielding good connectivity and productivity.
Keyword (in Japanese) (See Japanese page) 
(in English) Build-up substrate / Via structure / Impedance / Power Integrity / Reliability test / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 340, CPM2015-136, pp. 51-54, Dec. 2015.
Paper # CPM2015-136 
Date of Issue 2015-11-24 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

Conference Information
Committee VLD DC IPSJ-SLDM CPSY RECONF ICD CPM  
Conference Date 2015-12-01 - 2015-12-03 
Place (in Japanese) (See Japanese page) 
Place (in English) Nagasaki Kinro Fukushi Kaikan 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2015 -New Field of VLSI Design- 
Paper Information
Registration To CPM 
Conference Code 2015-12-VLD-DC-SLDM-CPSY-RECONF-ICD-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of Via Structures in IC Package Substrates for Impedance Reduction 
Sub Title (in English)  
Keyword(1) Build-up substrate  
Keyword(2) Via structure  
Keyword(3) Impedance  
Keyword(4) Power Integrity  
Keyword(5) Reliability test  
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1st Author's Name Tomoyuki Akaboshi  
1st Author's Affiliation FUJITSU LABORATORIES LTD. (Fujitsu Lab.)
2nd Author's Name Taiga Fukumori  
2nd Author's Affiliation FUJITSU LABORATORIES LTD. (Fujitsu Lab.)
3rd Author's Name Daisuke Mizutani  
3rd Author's Affiliation FUJITSU LABORATORIES LTD. (Fujitsu Lab.)
4th Author's Name Motoaki Tani  
4th Author's Affiliation FUJITSU LABORATORIES LTD. (Fujitsu Lab.)
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Speaker
Date Time 2015-12-03 10:50:00 
Presentation Time 50 
Registration for CPM 
Paper # IEICE-CPM2015-136,IEICE-ICD2015-61 
Volume (vol) IEICE-115 
Number (no) no.340(CPM), no.341(ICD) 
Page pp.51-54 
#Pages IEICE-4 
Date of Issue IEICE-CPM-2015-11-24,IEICE-ICD-2015-11-24 


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