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| Presentation | 2015-12-03 11:15 Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages Shougo Watanabe, Takashi Omura, Yuki Kitagawa, Lei Lin, Lin Meng, Masahiro Fukui (Ritsumeikan Univ.)  VLD2015-64 DC2015-60 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In this study, we consider the thermal distribution in three-dimensional, and we tried the efficiency of analytical calculation of the three-dimensional circuit using GPU. As a result, we have achieved improving the accuracy of analyzing the three-dimensional thermal transfer. Furthermore, we have achieved about 22.8 times speed-up than a CPU program while accelerating the speed of calculation by using GPU parallel computing. In this paper, we introduce heat transfer coefficient into our simulator to consider convection. And we compare our analysis results with the test results and another analysis results, and verify the accuracy of our simulation. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | GPU / thermal analysis / heat transfer / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 115, no. 339, DC2015-60, pp. 171-176, Dec. 2015. | |
| Paper # | DC2015-60 | |
| Date of Issue | 2015-11-24 (VLD, DC) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | VLD2015-64 DC2015-60 |
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| Conference Information | |
| Committee | VLD DC IPSJ-SLDM CPSY RECONF ICD CPM |
| Conference Date | 2015-12-01 - 2015-12-03 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Nagasaki Kinro Fukushi Kaikan |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2015 -New Field of VLSI Design- |
| Paper Information | |
| Registration To | DC |
| Conference Code | 2015-12-VLD-DC-SLDM-CPSY-RECONF-ICD-CPM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packages |
| Sub Title (in English) | |
| Keyword(1) | GPU |
| Keyword(2) | thermal analysis |
| Keyword(3) | heat transfer |
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| 1st Author's Name | Shougo Watanabe |
| 1st Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
| 2nd Author's Name | Takashi Omura |
| 2nd Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
| 3rd Author's Name | Yuki Kitagawa |
| 3rd Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
| 4th Author's Name | Lei Lin |
| 4th Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
| 5th Author's Name | Lin Meng |
| 5th Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
| 6th Author's Name | Masahiro Fukui |
| 6th Author's Affiliation | Ritsumeikan University (Ritsumeikan Univ.) |
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| Speaker | Author-1 |
| Date Time | 2015-12-03 11:15:00 |
| Presentation Time | 25 minutes |
| Registration for | DC |
| Paper # | VLD2015-64, DC2015-60 |
| Volume (vol) | vol.115 |
| Number (no) | no.338(VLD), no.339(DC) |
| Page | pp.171-176 |
| #Pages | 6 |
| Date of Issue | 2015-11-24 (VLD, DC) |
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