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| Presentation | 2015-03-02 14:55 [Invited Talk] Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance Ken Suzuki, Takery Kato, Hideo Miura (Tohoku Univ)  SDM2014-168 Link to ES Tech. Rep. Archives: SDM2014-168 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Both electrical and mechanical properties of electroplated copper thin-films vary drastically depending on their unique microtexture that mainly consists of fine columnar grains with porous grain boundaries. The variation of mechanical and electrical properties of electroplated copper thin-films should degrade the reliability of electronic devices seriously. In this study, in order to establish the design guideline for highly reliable copper interconnections, effects of the microtexture of electroplated copper thin-films, especially the crystallinity of grain boundaries, on stress-induced migration (SM) and electro migration (EM) were investigated. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Electroplated copper thin-film / Grain boundary / Residual stress / Stress-induced migration / Electro migration / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 114, no. 469, SDM2014-168, pp. 33-38, March 2015. | |
| Paper # | SDM2014-168 | |
| Date of Issue | 2015-02-23 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2014-168 Link to ES Tech. Rep. Archives: SDM2014-168 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2015-03-02 - 2015-03-02 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | http://www.ieice.org/jpn/about/syozai.html |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2015-03-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Effect of microtexture in electroplated copper thin-film interconnections on their migration resistance |
| Sub Title (in English) | |
| Keyword(1) | Electroplated copper thin-film |
| Keyword(2) | Grain boundary |
| Keyword(3) | Residual stress |
| Keyword(4) | Stress-induced migration |
| Keyword(5) | Electro migration |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Ken Suzuki |
| 1st Author's Affiliation | Tohoku Univ (Tohoku Univ) |
| 2nd Author's Name | Takery Kato |
| 2nd Author's Affiliation | Tohoku Univ (Tohoku Univ) |
| 3rd Author's Name | Hideo Miura |
| 3rd Author's Affiliation | Tohoku Univ (Tohoku Univ) |
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| Speaker | Author-1 |
| Date Time | 2015-03-02 14:55:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2014-168 |
| Volume (vol) | vol.114 |
| Number (no) | no.469 |
| Page | pp.33-38 |
| #Pages | 6 |
| Date of Issue | 2015-02-23 (SDM) |
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