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| Presentation | 2015-03-02 13:35 [Invited Talk] CNT Via Integration with Highly Dense and Selective CNT Growth Atsunobu Isobayashi, Makoto Wada, Ban Ito, Tatsuro Saito, Daisuke Nishide, T. Ishikura, Masayuki Katagiri, Yuichi Yamazaki, Takashi Matsumoto, Masayuki Kitamura, Masahito Watanabe, Naoshi Sakuma, Akihiro Kajita, Tadashi Sakai (LEAP)  SDM2014-167 Link to ES Tech. Rep. Archives: SDM2014-167 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In this study, a highly selective carbon nanotube (CNT) via process was developed using a sacrificial spin-on carbon (SOC) chemical mechanical polishing (CMP) and a sidewall sealing processes. These processes suppressed CNT growth from the top surface and via sidewalls respectively and, as a result, realized a highly uniform and dense CNT connection between the two wirings. By applying this to a two-level interconnects structure in 300mm wafer, 100% yield was achieved in 20k scale via chain test pattern with the via diameter of 100nm and a tight distribution of via resistance with highly dense CNT connecting the two wirings was obtained. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | CNT / via / selective growth / interconnect / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 114, no. 469, SDM2014-167, pp. 29-32, March 2015. | |
| Paper # | SDM2014-167 | |
| Date of Issue | 2015-02-23 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2014-167 Link to ES Tech. Rep. Archives: SDM2014-167 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2015-03-02 - 2015-03-02 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | http://www.ieice.org/jpn/about/syozai.html |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2015-03-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | CNT Via Integration with Highly Dense and Selective CNT Growth |
| Sub Title (in English) | |
| Keyword(1) | CNT |
| Keyword(2) | via |
| Keyword(3) | selective growth |
| Keyword(4) | interconnect |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Atsunobu Isobayashi |
| 1st Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 2nd Author's Name | Makoto Wada |
| 2nd Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 3rd Author's Name | Ban Ito |
| 3rd Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 4th Author's Name | Tatsuro Saito |
| 4th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 5th Author's Name | Daisuke Nishide |
| 5th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 6th Author's Name | T. Ishikura |
| 6th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 7th Author's Name | Masayuki Katagiri |
| 7th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 8th Author's Name | Yuichi Yamazaki |
| 8th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 9th Author's Name | Takashi Matsumoto |
| 9th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 10th Author's Name | Masayuki Kitamura |
| 10th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 11th Author's Name | Masahito Watanabe |
| 11th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 12th Author's Name | Naoshi Sakuma |
| 12th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 13th Author's Name | Akihiro Kajita |
| 13th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 14th Author's Name | Tadashi Sakai |
| 14th Author's Affiliation | Low-power Electronics Association & Project (LEAP) |
| 15th Author's Name | |
| 15th Author's Affiliation | () |
| 16th Author's Name | |
| 16th Author's Affiliation | () |
| 17th Author's Name | |
| 17th Author's Affiliation | () |
| 18th Author's Name | |
| 18th Author's Affiliation | () |
| Speaker | Author-13 |
| Date Time | 2015-03-02 13:35:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2014-167 |
| Volume (vol) | vol.114 |
| Number (no) | no.469 |
| Page | pp.29-32 |
| #Pages | 4 |
| Date of Issue | 2015-02-23 (SDM) |
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