Paper Abstract and Keywords |
Presentation |
2015-01-29 17:00
Temperature sensor applying Body Bias in Silicon-on-Thin-BOX Tsubasa Kosaka, Shohei Nakamura, Kimiyoshi Usami (S.I.T.) VLD2014-127 CPSY2014-136 RECONF2014-60 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The performance advancement by the transistor scaling is blocked by increase of power consumption and process variation. Silicon on Thin BOX(SOTB) solve these problems. In addition, there is a problem that the temperature changes in a transistor. The temperature change causes deterioration and the trouble of the transistor and causes malfunction of the chip. The temperature sensor which measures the temperature in the chip is necessary. In this paper, a temperature sensor for SOTB is proposed. We demonstrate that the temperature sensor for SOTB enables us to achieve high precision of the thermometry and mitigate the process variation at every chip by Body Bias than a conventional bulk transistor. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Silicon-on -Thin-BOX MOSFET / Body Biasv / Temperature sensor / Leakage monitor / Process variation / / / |
Reference Info. |
IEICE Tech. Rep., vol. 114, no. 426, VLD2014-127, pp. 99-104, Jan. 2015. |
Paper # |
VLD2014-127 |
Date of Issue |
2015-01-22 (VLD, CPSY, RECONF) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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VLD2014-127 CPSY2014-136 RECONF2014-60 |
Conference Information |
Committee |
RECONF CPSY VLD IPSJ-SLDM |
Conference Date |
2015-01-29 - 2015-01-30 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Hiyoshi Campus, Keio University |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
FPGA Applications, etc |
Paper Information |
Registration To |
VLD |
Conference Code |
2015-01-RECONF-CPSY-VLD-SLDM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Temperature sensor applying Body Bias in Silicon-on-Thin-BOX |
Sub Title (in English) |
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Keyword(1) |
Silicon-on -Thin-BOX MOSFET |
Keyword(2) |
Body Biasv |
Keyword(3) |
Temperature sensor |
Keyword(4) |
Leakage monitor |
Keyword(5) |
Process variation |
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1st Author's Name |
Tsubasa Kosaka |
1st Author's Affiliation |
Shibaura Institute of Technology (S.I.T.) |
2nd Author's Name |
Shohei Nakamura |
2nd Author's Affiliation |
Shibaura Institute of Technology (S.I.T.) |
3rd Author's Name |
Kimiyoshi Usami |
3rd Author's Affiliation |
Shibaura Institute (S.I.T.) |
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Speaker |
Author-1 |
Date Time |
2015-01-29 17:00:00 |
Presentation Time |
20 minutes |
Registration for |
VLD |
Paper # |
VLD2014-127, CPSY2014-136, RECONF2014-60 |
Volume (vol) |
vol.114 |
Number (no) |
no.426(VLD), no.427(CPSY), no.428(RECONF) |
Page |
pp.99-104 |
#Pages |
6 |
Date of Issue |
2015-01-22 (VLD, CPSY, RECONF) |
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