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| Presentation | 2015-01-27 14:25 [Invited Talk] Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto (The Univ. of Tokyo)  SDM2014-141 Link to ES Tech. Rep. Archives: SDM2014-141 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | We report the first demonstration of three-dimensional (3D) integrated CMOS image sensors with pixel-parallel A/D converters (ADCs), thereby meeting the demand for high resolution and high frame rate imaging. Photodiode (PD) and inverter layers were directly bonded with the damascened Au electrodes to provide each pixel with in-pixel A/D conversion. We designed ADC with a pulse frequency output and fabricated a prototype sensor with 64 pixels. The developed sensor successfully captured video images and confirmed excellent linearity with a wide dynamic range of more than 80 dB, which showed feasibility of pixel-level 3D integration for high-performance CMOS image sensors. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Image sensor / A/D Conversion / 3D Integration / SOI / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 114, no. 421, SDM2014-141, pp. 25-28, Jan. 2015. | |
| Paper # | SDM2014-141 | |
| Date of Issue | 2015-01-20 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2014-141 Link to ES Tech. Rep. Archives: SDM2014-141 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2015-01-27 - 2015-01-27 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2015-01-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers |
| Sub Title (in English) | |
| Keyword(1) | Image sensor |
| Keyword(2) | A/D Conversion |
| Keyword(3) | 3D Integration |
| Keyword(4) | SOI |
| Keyword(5) | |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Masahide Goto |
| 1st Author's Affiliation | Japan Broadcasting Corporation (NHK) |
| 2nd Author's Name | Kei Hagiwara |
| 2nd Author's Affiliation | Japan Broadcasting Corporation (NHK) |
| 3rd Author's Name | Yoshinori Iguchi |
| 3rd Author's Affiliation | Japan Broadcasting Corporation (NHK) |
| 4th Author's Name | Hiroshi Ohtake |
| 4th Author's Affiliation | Japan Broadcasting Corporation (NHK) |
| 5th Author's Name | Takuya Saraya |
| 5th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 6th Author's Name | Masaharu Kobayashi |
| 6th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 7th Author's Name | Eiji Higurashi |
| 7th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 8th Author's Name | Hiroshi Toshiyoshi |
| 8th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
| 9th Author's Name | Toshiro Hiramoto |
| 9th Author's Affiliation | The University of Tokyo (The Univ. of Tokyo) |
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| Speaker | Author-1 |
| Date Time | 2015-01-27 14:25:00 |
| Presentation Time | 25 minutes |
| Registration for | SDM |
| Paper # | SDM2014-141 |
| Volume (vol) | vol.114 |
| Number (no) | no.421 |
| Page | pp.25-28 |
| #Pages | 4 |
| Date of Issue | 2015-01-20 (SDM) |
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