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Paper Abstract and Keywords
Presentation 2014-12-19 11:05
Optical transmission between III-V chips on Si by using photonic wire bonding
Gu Zhichen, Tomohiro Amemiya (Tokyo Tech.), Atsushi Ishikawa (RIKEN), Yuki Atsumi (AIST), Kang Junhyung, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama (Tokyo Tech.), Takuo Tanaka (RIKEN), Shigehisa Arai (Tokyo Tech.) Link to ES Tech. Rep. Archives: OPE2014-143 LQE2014-130
Abstract (in Japanese) (See Japanese page) 
(in English) In this paper, we present some design considerations and fabrication process of photonic wire bonding (PWB) based on two-photon polymerization of ultraviolet curable resin SU-8 to achieve flexible chip scale optical interconnection. Firstly, we figured out the fabrication conditions of PWB regarding two photon absorption process excited by femtosecond laser and we numerically simulated the coupling structure between PWB and III-V optical component in order to obtain high coupling efficiency. By using the PWB, we realized a chip-to-chip optical transmission between laser and detector chips which were located on a Si substrate.
Keyword (in Japanese) (See Japanese page) 
(in English) Optical interconnection / Femtosecond Laser / Compound Semiconductors / Integrated Optics / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 377, OPE2014-143, pp. 21-26, Dec. 2014.
Paper # OPE2014-143 
Date of Issue 2014-12-11 (OPE, LQE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (No. 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

Conference Information
Committee OPE LQE  
Conference Date 2014-12-18 - 2014-12-19 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan, NTT Atsugi R&D center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Optical passive component (filter, connector, MEMS), Semiconductor lasers, Silicon photonics, etc 
Paper Information
Registration To OPE 
Conference Code 2014-12-OPE-LQE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Optical transmission between III-V chips on Si by using photonic wire bonding 
Sub Title (in English)  
Keyword(1) Optical interconnection  
Keyword(2) Femtosecond Laser  
Keyword(3) Compound Semiconductors  
Keyword(4) Integrated Optics  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Gu Zhichen  
1st Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
2nd Author's Name Tomohiro Amemiya  
2nd Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
3rd Author's Name Atsushi Ishikawa  
3rd Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
4th Author's Name Yuki Atsumi  
4th Author's Affiliation Advanced Industrial Science and Techonology (AIST)
5th Author's Name Kang Junhyung  
5th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
6th Author's Name Takuo Hiratani  
6th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
7th Author's Name Yusuke Hayashi  
7th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
8th Author's Name Junichi Suzuki  
8th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
9th Author's Name Nobuhiko Nishiyama  
9th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
10th Author's Name Takuo Tanaka  
10th Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
11th Author's Name Shigehisa Arai  
11th Author's Affiliation Tokyo Institute of Technology (Tokyo Tech.)
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Speaker
Date Time 2014-12-19 11:05:00 
Presentation Time 25 
Registration for OPE 
Paper # IEICE-OPE2014-143,IEICE-LQE2014-130 
Volume (vol) IEICE-114 
Number (no) no.377(OPE), no.378(LQE) 
Page pp.21-26 
#Pages IEICE-6 
Date of Issue IEICE-OPE-2014-12-11,IEICE-LQE-2014-12-11 


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