IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2014-11-28 16:00
Effects of thermal cleaning on surface of bulk GaN substrates
Shunsuke Okada, Hideto Miyake, Kazumasa Hiramatsu (Mie Univ.), Reina Miyagawa, Osamu Eryu (Nagoya Inst. Tech.), Tamotsu Hashizume (Hokkaido Univ.) ED2014-96 CPM2014-153 LQE2014-124 Link to ES Tech. Rep. Archives: ED2014-96 CPM2014-153 LQE2014-124
Abstract (in Japanese) (See Japanese page) 
(in English) Thermal cleaning at high temperature from 800 oC to 1100 oC of free-standing polar (0001) plane and non-polar (10-10) (20-21) (20-2-1) plane GaN substrates was demonstrated, and the change of surface morphologies were shown. In the case of polar (0001) plane, polishing scratches on the surface decreased with increased thermal cleaning temperature, and atomic step was appeared at 1000 oC. At 1100 oC, desorption of surface occurred and surface morphologies became rough. In the case of non-polar GaN substrates, surface morphologies after thermal cleaning were markedly different based on orientation of surface. Surface roughness of (20-21) plane GaN drastically deteriorated with increasing thermal cleaning temperature.
Keyword (in Japanese) (See Japanese page) 
(in English) GaN / thermal cleaning / free-standing substrate / / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 338, LQE2014-124, pp. 111-115, Nov. 2014.
Paper # LQE2014-124 
Date of Issue 2014-11-20 (ED, CPM, LQE) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
Download PDF ED2014-96 CPM2014-153 LQE2014-124 Link to ES Tech. Rep. Archives: ED2014-96 CPM2014-153 LQE2014-124

Conference Information
Committee LQE ED CPM  
Conference Date 2014-11-27 - 2014-11-28 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To LQE 
Conference Code 2014-11-LQE-ED-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Effects of thermal cleaning on surface of bulk GaN substrates 
Sub Title (in English)  
Keyword(1) GaN  
Keyword(2) thermal cleaning  
Keyword(3) free-standing substrate  
1st Author's Name Shunsuke Okada  
1st Author's Affiliation Mie University (Mie Univ.)
2nd Author's Name Hideto Miyake  
2nd Author's Affiliation Mie University (Mie Univ.)
3rd Author's Name Kazumasa Hiramatsu  
3rd Author's Affiliation Mie University (Mie Univ.)
4th Author's Name Reina Miyagawa  
4th Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. Tech.)
5th Author's Name Osamu Eryu  
5th Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. Tech.)
6th Author's Name Tamotsu Hashizume  
6th Author's Affiliation Hokkaido University (Hokkaido Univ.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Date Time 2014-11-28 16:00:00 
Presentation Time 25 
Registration for LQE 
Paper # IEICE-ED2014-96,IEICE-CPM2014-153,IEICE-LQE2014-124 
Volume (vol) IEICE-114 
Number (no) no.336(ED), no.337(CPM), no.338(LQE) 
Page pp.111-115 
#Pages IEICE-5 
Date of Issue IEICE-ED-2014-11-20,IEICE-CPM-2014-11-20,IEICE-LQE-2014-11-20 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan