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Paper Abstract and Keywords
Presentation 2014-05-23 14:50
A study on image processing of the object detection using frequency domain correlation in radiographic inspection equipment
Yoichi Kato (Aichi Pref. Univ.), Motoaki Mouri (Aichi Univ.), Hiroshi Yasukawa (Aichi Pref. Univ.) SIP2014-19 IE2014-19 PRMU2014-19 MI2014-19
Abstract (in Japanese) (See Japanese page) 
(in English) X-ray inspection equipment is often used by the inspection of PCB required high quality. Especially BGA solder-bumps sealed by the LSI package resin are mainly inspected by X-ray. In recent years, miniaturization of the solder-bumps and multi-layering of LSI structure make X-ray inspection indispensable because of the improved quality of industrial products, and improvement in image quality is required much more. Although the conventional technique of the noise suppressed on an inspection image is an addition average processing, the increase in X-ray inspection time is influenced critically. So, in the main subject, the image processing technology which reduces the frame number for addition average processing rather than the conventional technique is proposed. At first, a reference image of the integrous BGA solder-bumps is prepared in order to improve quality of an inspection image. Second, in a low-frequency region, alphablend is performed with the correlation coefficient between the power spectrum of an inspection and a reference image. Finally, image quality is improved in real space, and the validity which can reduce the frame number by the proposed technique less than the conventional is examined.
Keyword (in Japanese) (See Japanese page) 
(in English) BGA solder-bump / Inspection image / Reference image / Correlation coefficient / alphaBlend / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 39, SIP2014-19, pp. 99-105, May 2014.
Paper # SIP2014-19 
Date of Issue 2014-05-15 (SIP, IE, PRMU, MI) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SIP2014-19 IE2014-19 PRMU2014-19 MI2014-19

Conference Information
Committee PRMU MI IE SIP  
Conference Date 2014-05-22 - 2014-05-23 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
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Paper Information
Registration To SIP 
Conference Code 2014-05-PRMU-MI-IE-SIP 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A study on image processing of the object detection using frequency domain correlation in radiographic inspection equipment 
Sub Title (in English)  
Keyword(1) BGA solder-bump  
Keyword(2) Inspection image  
Keyword(3) Reference image  
Keyword(4) Correlation coefficient  
Keyword(5) alphaBlend  
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1st Author's Name Yoichi Kato  
1st Author's Affiliation Aichi Prefectural University (Aichi Pref. Univ.)
2nd Author's Name Motoaki Mouri  
2nd Author's Affiliation Aichi University (Aichi Univ.)
3rd Author's Name Hiroshi Yasukawa  
3rd Author's Affiliation Aichi Prefectural University (Aichi Pref. Univ.)
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Speaker Author-1 
Date Time 2014-05-23 14:50:00 
Presentation Time 30 minutes 
Registration for SIP 
Paper # SIP2014-19, IE2014-19, PRMU2014-19, MI2014-19 
Volume (vol) vol.114 
Number (no) no.39(SIP), no.40(IE), no.41(PRMU), no.42(MI) 
Page pp.99-105 
#Pages
Date of Issue 2014-05-15 (SIP, IE, PRMU, MI) 


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