IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2014-03-07 10:20
Resilient Multi-layer Network Designs and Evaluations
Haruki Omuro, Taiju Mikoshi, Toyofumi Takenaka (Nihon Univ.) NS2013-238
Abstract (in Japanese) (See Japanese page) 
(in English) In resilient Multi-layer network (MLN) design method, the shared restoration method has been studied to achieve the resilience against link failures. In this method, for the sake of cost saving the same wavelength is shared among plural optical paths, and the backup optical path is set up against link failure using shared wavelength. However, when solving Integer Liner Programming (ILP) for MLN design using shared restoration method, the larger the network scale is, the harder it becomes to solve. In this paper, in order to cope with this difficulty, we formulate ILP which optimizes working paths and backup paths individually and reduce the number of variables for large scale networks. We evaluate the proposed method from viewpoints of cost performance and calculation times and show the effectiveness of the proposed method.
Keyword (in Japanese) (See Japanese page) 
(in English) Multi-layer Network Design / Resilience / Shared Restoration / Integer Liner Programming / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 472, NS2013-238, pp. 355-360, March 2014.
Paper # NS2013-238 
Date of Issue 2014-02-27 (NS) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF NS2013-238

Conference Information
Committee NS IN  
Conference Date 2014-03-06 - 2014-03-07 
Place (in Japanese) (See Japanese page) 
Place (in English) Miyazaki Seagia 
Topics (in Japanese) (See Japanese page) 
Topics (in English) General 
Paper Information
Registration To NS 
Conference Code 2014-03-NS-IN 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Resilient Multi-layer Network Designs and Evaluations 
Sub Title (in English)  
Keyword(1) Multi-layer Network Design  
Keyword(2) Resilience  
Keyword(3) Shared Restoration  
Keyword(4) Integer Liner Programming  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Haruki Omuro  
1st Author's Affiliation Nihon University (Nihon Univ.)
2nd Author's Name Taiju Mikoshi  
2nd Author's Affiliation Nihon University (Nihon Univ.)
3rd Author's Name Toyofumi Takenaka  
3rd Author's Affiliation Nihon University (Nihon Univ.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2014-03-07 10:20:00 
Presentation Time 20 minutes 
Registration for NS 
Paper # NS2013-238 
Volume (vol) vol.113 
Number (no) no.472 
Page pp.355-360 
#Pages
Date of Issue 2014-02-27 (NS) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan