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| Presentation | 2014-02-28 15:50 [Invited Talk] 15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique -- for Advanced Chip Stacking Applications -- Masahiro Aoyagi, Thanh-Tung Bui, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi (AIST)  SDM2013-173 Link to ES Tech. Rep. Archives: SDM2013-173 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | This paper reports the development of reliable fine-pitch micro-bump Cu/Au interconnections relied on a high-precision room-temperature bonding approach. The accuracy of the bonding process is improved by means of modifying the conventional bump/planar-bonding-pad interconnections, to form self-aligned micro-bumps/truncated inverted pyramid (TIP) bonding pads, i.e., misalignment self-correction elements (MSCEs). Thermosonic flip-chip bonding (FCB) technique is utilized to form reliable bonds between these MSCEs at acceptable low temperatures. Applying the proposed bonding approach, the demonstration of fine-pitch Cu bump to Au bonding pad interconnects chip stacking has been relied. The microstructure analyses reveal that the 15-μm-pitch micro-bump joints were made at room temperature. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Flip Chip / Bonding / Fine Pitch / Micro Bump / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 113, no. 451, SDM2013-173, pp. 43-46, Feb. 2014. | |
| Paper # | SDM2013-173 | |
| Date of Issue | 2014-02-21 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2013-173 Link to ES Tech. Rep. Archives: SDM2013-173 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2014-02-28 - 2014-02-28 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2014-02-SDM |
| Language | English (Japanese title is available) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique |
| Sub Title (in English) | for Advanced Chip Stacking Applications |
| Keyword(1) | Flip Chip |
| Keyword(2) | Bonding |
| Keyword(3) | Fine Pitch |
| Keyword(4) | Micro Bump |
| Keyword(5) | |
| Keyword(6) | |
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| Keyword(8) | |
| 1st Author's Name | Masahiro Aoyagi |
| 1st Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 2nd Author's Name | Thanh-Tung Bui |
| 2nd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 3rd Author's Name | Fumiki Kato |
| 3rd Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 4th Author's Name | Naoya Watanabe |
| 4th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 5th Author's Name | Shunsuke Nemoto |
| 5th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
| 6th Author's Name | Katsuya Kikuchi |
| 6th Author's Affiliation | National Institute of Advanced Industrial Science and Technology (AIST) |
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| Speaker | Author-1 |
| Date Time | 2014-02-28 15:50:00 |
| Presentation Time | 30 minutes |
| Registration for | SDM |
| Paper # | SDM2013-173 |
| Volume (vol) | vol.113 |
| Number (no) | no.451 |
| Page | pp.43-46 |
| #Pages | 4 |
| Date of Issue | 2014-02-21 (SDM) |
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