Paper Abstract and Keywords |
Presentation |
2014-01-29 10:50
[Invited Talk]
Heated Ion Implantation Technology for Highly Reliable Metal-gate/High-k CMOS SOI FinFETs Wataru Mizubayashi (AIST), Hiroshi Onoda, Yoshiki Nakashima (Nissin Ion Equipment), Yuki Ishikawa, Takashi Matsukawa, Kazuhiko Endo, Yongxun Liu, Shinichi Ouchi, Junichi Tsukada, Hiromi Yamauchi, Shinji Migita, Yukinori Morita, Hiroyuki Ota, Meishoku Masahara (AIST) SDM2013-138 Link to ES Tech. Rep. Archives: SDM2013-138 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The impact of heated ion implantation (I/I) technology on metal-gate (MG)/high-k (HK) CMOS SOI FinFET performance and reliability has been thoroughly investigated. It was demonstrated that heated I/I brings perfect crystallization after annealing even in ultrathin Si channel. For the first time, it was found that heated I/I dramatically improves the characteristics such as Ion-Ioff, Vth variability, and bias temperature instability (BTI) for both nMOS and pMOS FinFETs in comparison with conventional room temperature I/I. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
FinFETs / Source/drain Extension / Heated Ion Implantation / Crystallization / Ion / Ioff / BTI Characteristics / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 420, SDM2013-138, pp. 13-16, Jan. 2014. |
Paper # |
SDM2013-138 |
Date of Issue |
2014-01-22 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
SDM2013-138 Link to ES Tech. Rep. Archives: SDM2013-138 |
|