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| Presentation | 2013-12-20 13:05 [Invited Talk] Optrical Packaging of Silicon Phtonic Devices -- External Connection of Parallel Optical Signals -- Yoichi Taira, Hidetoshi Numata (IBM Japan)  OPE2013-138 Link to ES Tech. Rep. Archives: OPE2013-138 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Optical packaging method is necessary for silicon nanophotinic devices. We evaluate various optical connection methods for the silicon photonic transceivers, in terms of connection of waveguides on silicon chips to the external optical cables. An intermediate optical path such as optical waveguides or optical fibers is beneficial to couple the on-silicon optical signals with external fibers for high bandwidth transceiver devices. For the CPU like modules with large bandwidth optical input and output, various requirements such as for electrical and optical connection, accurate module positioning, and cleanliness of the optical interface have to be considered. The dual lens coupling scheme is effective in relaxing these requirements. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | silicon photonics / optical packaging / microlent / optical connector / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 113, no. 370, OPE2013-138, pp. 1-6, Dec. 2013. | |
| Paper # | OPE2013-138 | |
| Date of Issue | 2013-12-13 (OPE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | OPE2013-138 Link to ES Tech. Rep. Archives: OPE2013-138 |
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| Conference Information | |
| Committee | OPE |
| Conference Date | 2013-12-20 - 2013-12-20 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | OPE |
| Conference Code | 2013-12-OPE |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Optrical Packaging of Silicon Phtonic Devices |
| Sub Title (in English) | External Connection of Parallel Optical Signals |
| Keyword(1) | silicon photonics |
| Keyword(2) | optical packaging |
| Keyword(3) | microlent |
| Keyword(4) | optical connector |
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| 1st Author's Name | Yoichi Taira |
| 1st Author's Affiliation | IBM Japan Ltd. (IBM Japan) |
| 2nd Author's Name | Hidetoshi Numata |
| 2nd Author's Affiliation | IBM Japan Ltd. (IBM Japan) |
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| Speaker | Author-1 |
| Date Time | 2013-12-20 13:05:00 |
| Presentation Time | 30 minutes |
| Registration for | OPE |
| Paper # | OPE2013-138 |
| Volume (vol) | vol.113 |
| Number (no) | no.370 |
| Page | pp.1-6 |
| #Pages | 6 |
| Date of Issue | 2013-12-13 (OPE) |
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