講演抄録/キーワード |
講演名 |
2013-11-16 13:00
Multi-physics Coupling Simulation in the Design of Thermal Overload Relay ○Xun Shao・Weihua Wang・Xianping Yuan(Schneider Electric) EMD2013-86 エレソ技報アーカイブへのリンク:EMD2013-86 |
抄録 |
(和) |
Abstract: Thermal Overload Relay is a typical product under multi-physics coupling condition. The principle is that bimetal deflects under the effect of electrical, thermal and mechanical, tripping the mechanism till a threshold. This article is to introduce a method of using multi-physics coupling simulation to calculate the bimetal temperature distribution in both transient and steady, and the related bimetal deflection with comparison test results. The method makes it easier and more precise to get bimetal temperature distribution and bimetal deflection, especially when winded by heater, decreases the design cycle time and cost. |
(英) |
Abstract: Thermal Overload Relay is a typical product under multi-physics coupling condition. The principle is that bimetal deflects under the effect of electrical, thermal and mechanical, tripping the mechanism till a threshold. This article is to introduce a method of using multi-physics coupling simulation to calculate the bimetal temperature distribution in both transient and steady, and the related bimetal deflection with comparison test results. The method makes it easier and more precise to get bimetal temperature distribution and bimetal deflection, especially when winded by heater, decreases the design cycle time and cost. |
キーワード |
(和) |
Thermal Overload Relay / Multi-physics Coupling Simulation / / / / / / |
(英) |
Thermal Overload Relay / Multi-physics Coupling Simulation / / / / / / |
文献情報 |
信学技報, vol. 113, no. 298, EMD2013-86, pp. 47-49, 2013年11月. |
資料番号 |
EMD2013-86 |
発行日 |
2013-11-09 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
EMD2013-86 エレソ技報アーカイブへのリンク:EMD2013-86 |