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Paper Abstract and Keywords
Presentation 2013-11-14 14:50
Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress
Akira Saito, Akira Okamoto, Yoshihiro Iwahori, Makoto Ogawa (Mutrata MFG), Akihiro Motoki (Sabae Mutrata MFG) R2013-76
Abstract (in Japanese) (See Japanese page) 
(in English) With the promotion of lead-free solder in these years, some segments have expressed concern about the possibility of tin whisker formation in high-reliability applications. In our recent report, it was revealed that the formation of plate-shape Ni-Sn intermetallic compound (IMC) in tin plating layer inhibits the tin whisker growth under thermal shock stress. In this report, we propose that the thermal stress reduction by the nodule growth that promoted by plate-shape Ni-Sn IMC in tin layer causes the inhibition of whisker growth.
Keyword (in Japanese) (See Japanese page) 
(in English) Tin Whisker / Thermal Stress / Intermetallic Compound / Nodule / SEM observation / NiSn4 / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 289, R2013-76, pp. 11-16, Nov. 2013.
Paper # R2013-76 
Date of Issue 2013-11-07 (R) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee R  
Conference Date 2013-11-14 - 2013-11-14 
Place (in Japanese) (See Japanese page) 
Place (in English)  
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Paper Information
Registration To R 
Conference Code 2013-11-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Effect of Plate-Shape Ni-Sn IMC on the Growth Mechanism of Tin Whisker under Thermal Shock Stress 
Sub Title (in English)  
Keyword(1) Tin Whisker  
Keyword(2) Thermal Stress  
Keyword(3) Intermetallic Compound  
Keyword(4) Nodule  
Keyword(5) SEM observation  
Keyword(6) NiSn4  
Keyword(7)  
Keyword(8)  
1st Author's Name Akira Saito  
1st Author's Affiliation Murata Manufacturing Co., Ltd. (Mutrata MFG)
2nd Author's Name Akira Okamoto  
2nd Author's Affiliation Murata Manufacturing Co., Ltd. (Mutrata MFG)
3rd Author's Name Yoshihiro Iwahori  
3rd Author's Affiliation Murata Manufacturing Co., Ltd. (Mutrata MFG)
4th Author's Name Makoto Ogawa  
4th Author's Affiliation Murata Manufacturing Co., Ltd. (Mutrata MFG)
5th Author's Name Akihiro Motoki  
5th Author's Affiliation Sabae Murata Manufacturing Co., Ltd. (Sabae Mutrata MFG)
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Speaker
Date Time 2013-11-14 14:50:00 
Presentation Time 25 
Registration for R 
Paper # IEICE-R2013-76 
Volume (vol) IEICE-113 
Number (no) no.289 
Page pp.11-16 
#Pages IEICE-6 
Date of Issue IEICE-R-2013-11-07 


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