Paper Abstract and Keywords |
Presentation |
2013-08-29 11:35
Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Akira Ohki, Ryuzo Iga, Hiroyuki Ishii (NTT) R2013-34 EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33 Link to ES Tech. Rep. Archives: EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We developed the first EADFB laser array module with new flip-chip interconnects which provide low crosstalk and high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved up to 24% compared with that of a wire interconnection module. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
100GigabitEthernet / semiconductor laser / EADFB laser / flip-chip interconnection / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 190, LQE2013-33, pp. 31-34, Aug. 2013. |
Paper # |
LQE2013-33 |
Date of Issue |
2013-08-22 (R, EMD, CPM, OPE, LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
R2013-34 EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33 Link to ES Tech. Rep. Archives: EMD2013-40 CPM2013-59 OPE2013-63 LQE2013-33 |
Conference Information |
Committee |
OPE LQE CPM EMD R |
Conference Date |
2013-08-29 - 2013-08-30 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
sun-refre Hakodate |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
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Paper Information |
Registration To |
LQE |
Conference Code |
2013-08-OPE-LQE-CPM-EMD-R |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module |
Sub Title (in English) |
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Keyword(1) |
100GigabitEthernet |
Keyword(2) |
semiconductor laser |
Keyword(3) |
EADFB laser |
Keyword(4) |
flip-chip interconnection |
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1st Author's Name |
Shigeru Kanazawa |
1st Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
2nd Author's Name |
Takeshi Fujisawa |
2nd Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
3rd Author's Name |
Kiyoto Takahata |
3rd Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
4th Author's Name |
Akira Ohki |
4th Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
5th Author's Name |
Ryuzo Iga |
5th Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
6th Author's Name |
Hiroyuki Ishii |
6th Author's Affiliation |
Nippon Telegraph and Telephone Corporation (NTT) |
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Speaker |
Author-1 |
Date Time |
2013-08-29 11:35:00 |
Presentation Time |
25 minutes |
Registration for |
LQE |
Paper # |
R2013-34, EMD2013-40, CPM2013-59, OPE2013-63, LQE2013-33 |
Volume (vol) |
vol.113 |
Number (no) |
no.186(R), no.187(EMD), no.188(CPM), no.189(OPE), no.190(LQE) |
Page |
pp.31-34 |
#Pages |
4 |
Date of Issue |
2013-08-22 (R, EMD, CPM, OPE, LQE) |
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