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Paper Abstract and Keywords
Presentation 2013-05-17 13:35
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2013-1 Link to ES Tech. Rep. Archives: EMD2013-1
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its experimental results. When a discharge current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in the overlapped copper foils and an insulated aluminum driver sheet placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet and lets the copper foils collide. The foils can be welded both by the impact effect of the collision and by the Joule heat generated in them. The foils do not m elt. The bank energy required for this welding is less than 1.3 kJ.
Keyword (in Japanese) (See Japanese page) 
(in English) Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Electromagnetic force / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 48, EMD2013-1, pp. 1-4, May 2013.
Paper # EMD2013-1 
Date of Issue 2013-05-10 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2013-1 Link to ES Tech. Rep. Archives: EMD2013-1

Conference Information
Committee EMD  
Conference Date 2013-05-17 - 2013-05-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Chitose Arcadia Plaza 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2013-05-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards 
Sub Title (in English)  
Keyword(1) Printed circuit board  
Keyword(2) Rigid board  
Keyword(3) Flexible board  
Keyword(4) Copper foil  
Keyword(5) Magnetic pulse welding  
Keyword(6) Electromagnetic force  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
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Date Time 2013-05-17 13:35:00 
Presentation Time 25 
Registration for EMD 
Paper # IEICE-EMD2013-1 
Volume (vol) IEICE-113 
Number (no) no.48 
Page pp.1-4 
#Pages IEICE-4 
Date of Issue IEICE-EMD-2013-05-10 

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