Paper Abstract and Keywords |
Presentation |
2013-05-17 13:35
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2013-1 Link to ES Tech. Rep. Archives: EMD2013-1 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its experimental results. When a discharge current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in the overlapped copper foils and an insulated aluminum driver sheet placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet and lets the copper foils collide. The foils can be welded both by the impact effect of the collision and by the Joule heat generated in them. The foils do not m elt. The bank energy required for this welding is less than 1.3 kJ. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Electromagnetic force / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 48, EMD2013-1, pp. 1-4, May 2013. |
Paper # |
EMD2013-1 |
Date of Issue |
2013-05-10 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2013-1 Link to ES Tech. Rep. Archives: EMD2013-1 |
Conference Information |
Committee |
EMD |
Conference Date |
2013-05-17 - 2013-05-17 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Chitose Arcadia Plaza |
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(See Japanese page) |
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Paper Information |
Registration To |
EMD |
Conference Code |
2013-05-EMD |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards |
Sub Title (in English) |
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Keyword(1) |
Printed circuit board |
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Rigid board |
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Flexible board |
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Copper foil |
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Magnetic pulse welding |
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Electromagnetic force |
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1st Author's Name |
Tomokatsu Aizawa |
1st Author's Affiliation |
Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College) |
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Speaker |
Author-1 |
Date Time |
2013-05-17 13:35:00 |
Presentation Time |
25 minutes |
Registration for |
EMD |
Paper # |
EMD2013-1 |
Volume (vol) |
vol.113 |
Number (no) |
no.48 |
Page |
pp.1-4 |
#Pages |
4 |
Date of Issue |
2013-05-10 (EMD) |