IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2013-02-27 17:20
Field-Assisted Self -Assembly Process of InAs nanowires
Hiroaki Funayama, Tatsuro Watanabe, Kenji Michimata, Takao Waho, Shin Murakami, Kazuhiko Shimomura (Sophia Univ.) ED2012-136 SDM2012-165 Link to ES Tech. Rep. Archives: ED2012-136 SDM2012-165
Abstract (in Japanese) (See Japanese page) 
(in English) Field-assisted self-assembly process (FASA) of InAs and InAs/InP core-shell nanowires onto a Si substrate has been investigated. The dependence of the FASA yield on the frequency of the AC voltage applied between the FASA electrodes is examined. Furthermore, nanowires are deposited onto a MOS substrate to obtain an nMOS inverter. It is confirmed that the inverter operates properly.
Keyword (in Japanese) (See Japanese page) 
(in English) nanowire / field-assisted self-assembly / InAs / InP / / / /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 445, ED2012-136, pp. 43-46, Feb. 2013.
Paper # ED2012-136 
Date of Issue 2013-02-20 (ED, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2012-136 SDM2012-165 Link to ES Tech. Rep. Archives: ED2012-136 SDM2012-165

Conference Information
Committee SDM ED  
Conference Date 2013-02-27 - 2013-02-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkaido Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Functional nanodevices and related technologies 
Paper Information
Registration To ED 
Conference Code 2013-02-SDM-ED 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Field-Assisted Self -Assembly Process of InAs nanowires 
Sub Title (in English)  
Keyword(1) nanowire  
Keyword(2) field-assisted self-assembly  
Keyword(3) InAs  
Keyword(4) InP  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroaki Funayama  
1st Author's Affiliation Sophia University (Sophia Univ.)
2nd Author's Name Tatsuro Watanabe  
2nd Author's Affiliation Sophia University (Sophia Univ.)
3rd Author's Name Kenji Michimata  
3rd Author's Affiliation Sophia University (Sophia Univ.)
4th Author's Name Takao Waho  
4th Author's Affiliation Sophia University (Sophia Univ.)
5th Author's Name Shin Murakami  
5th Author's Affiliation Sophia University (Sophia Univ.)
6th Author's Name Kazuhiko Shimomura  
6th Author's Affiliation Sophia University (Sophia Univ.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2013-02-27 17:20:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2012-136, SDM2012-165 
Volume (vol) vol.112 
Number (no) no.445(ED), no.446(SDM) 
Page pp.43-46 
#Pages
Date of Issue 2013-02-20 (ED, SDM) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan