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Paper Abstract and Keywords
Presentation 2013-02-04 13:50
Nano-ordered Evaluation for Local Distribution of Adhesion Strength Between Cu/Dielectric in LSI Circuit
S.Kamiya, Hisashi Sato (Nagoya Inst. of Tech.), Masaki Omiya (Keio Univ.), Nobuyuki Shishido, Kozo Koiwa, Masahiro Nishida (Nagoya Inst. of Tech.), Tomoji Nakamura, Takashi Suzuki (Fujitsu Labs), Takeshi Nokuo, Toshiaki Suzuki (JEOL) SDM2012-153 Link to ES Tech. Rep. Archives: SDM2012-153
Abstract (in Japanese) (See Japanese page) 
(in English) One of serious problems for LSI is the weakness of interfaces in Cu/dielectric systems along with the trend of further miniaturization. Although adhesion strength of those interfaces is previously evaluated by macroscopic tests such as four point bending, the local interface adhesion strength in recent LSI with very fine structures is influenced by the local microstructure of Cu lines. This is because that crystal orientation, high angle grain boundaries and twins influence on the local deformation. In this study, novel evaluation method for the local adhesion interface-strength of the Cu/dielectric interface on the sub-micron Cu damascene is proposed.
Keyword (in Japanese) (See Japanese page) 
(in English) LSI circuit / Cu damascene / Cu/dielectric interface / Local adhesion strength / crystal orientation / grain boundary / plastic deformation /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 427, SDM2012-153, pp. 15-20, Feb. 2013.
Paper # SDM2012-153 
Date of Issue 2013-01-28 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2012-153 Link to ES Tech. Rep. Archives: SDM2012-153

Conference Information
Committee SDM  
Conference Date 2013-02-04 - 2013-02-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2013-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Nano-ordered Evaluation for Local Distribution of Adhesion Strength Between Cu/Dielectric in LSI Circuit 
Sub Title (in English)  
Keyword(1) LSI circuit  
Keyword(2) Cu damascene  
Keyword(3) Cu/dielectric interface  
Keyword(4) Local adhesion strength  
Keyword(5) crystal orientation  
Keyword(6) grain boundary  
Keyword(7) plastic deformation  
Keyword(8)  
1st Author's Name S.Kamiya  
1st Author's Affiliation Nagoya Inst. of Tech. (Nagoya Inst. of Tech.)
2nd Author's Name Hisashi Sato  
2nd Author's Affiliation Nagoya Inst. of Tech. (Nagoya Inst. of Tech.)
3rd Author's Name Masaki Omiya  
3rd Author's Affiliation Keio University (Keio Univ.)
4th Author's Name Nobuyuki Shishido  
4th Author's Affiliation Nagoya Inst. of Tech. (Nagoya Inst. of Tech.)
5th Author's Name Kozo Koiwa  
5th Author's Affiliation Nagoya Inst. of Tech. (Nagoya Inst. of Tech.)
6th Author's Name Masahiro Nishida  
6th Author's Affiliation Nagoya Inst. of Tech. (Nagoya Inst. of Tech.)
7th Author's Name Tomoji Nakamura  
7th Author's Affiliation Fujitsu Laboratories (Fujitsu Labs)
8th Author's Name Takashi Suzuki  
8th Author's Affiliation Fujitsu Laboratories (Fujitsu Labs)
9th Author's Name Takeshi Nokuo  
9th Author's Affiliation JEOL (JEOL)
10th Author's Name Toshiaki Suzuki  
10th Author's Affiliation JEOL (JEOL)
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Speaker Author-1 
Date Time 2013-02-04 13:50:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2012-153 
Volume (vol) vol.112 
Number (no) no.427 
Page pp.15-20 
#Pages
Date of Issue 2013-01-28 (SDM) 


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