IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2013-01-25 13:35
[Invited Talk] The latest trend of PCB pattern design technique for LSI stable operation, suppressing noise and high speed serial interface
Akihiro Tanaka, Hiroyuki Motoki, Hideyuki Nakanishi (Aica Kogyo) EMD2012-97 Link to ES Tech. Rep. Archives: EMD2012-97
Abstract (in Japanese) (See Japanese page) 
(in English) A design method for power distribution network of printed circuit board (PCB) adopting the parameters of input impedance (Z11) and transfer impedance (Z21) are proposed as the latest trend of PCB pattern design technique for LSI operation stability and reducing radiation noise from PCB. Furthermore, the case also shows that taking into account the power characteristics of LSI. Design optimization can be performed by quantifying Z11 and Z21 in PCB design phase. It also introduces the latest simulation methodology that helps to validate when designing a high-speed serial interface over 8.5Gbps class. We can verify it with a short period and practical operation by using IBIS-AMI as driver and receiver model, and considering PCB mounting effect for transmission line characteristics.
Keyword (in Japanese) (See Japanese page) 
(in English) Input Impedance(Z11) / Transfer Impedance(Z21) / LSI Operation Stability / Emission / Pattern Design / Printed Circuit Board / High Speed Serial Interface / Simulation  
Reference Info. IEICE Tech. Rep., vol. 112, no. 415, EMD2012-97, pp. 1-1, Jan. 2013.
Paper # EMD2012-97 
Date of Issue 2013-01-18 (EMD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2012-97 Link to ES Tech. Rep. Archives: EMD2012-97

Conference Information
Committee EMD  
Conference Date 2013-01-25 - 2013-01-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Hitachi, Ltd., (Totsuka, Yokohama) 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2013-01-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The latest trend of PCB pattern design technique for LSI stable operation, suppressing noise and high speed serial interface 
Sub Title (in English)  
Keyword(1) Input Impedance(Z11)  
Keyword(2) Transfer Impedance(Z21)  
Keyword(3) LSI Operation Stability  
Keyword(4) Emission  
Keyword(5) Pattern Design  
Keyword(6) Printed Circuit Board  
Keyword(7) High Speed Serial Interface  
Keyword(8) Simulation  
1st Author's Name Akihiro Tanaka  
1st Author's Affiliation Aica Kogyo Co., Ltd. (Aica Kogyo)
2nd Author's Name Hiroyuki Motoki  
2nd Author's Affiliation Aica Kogyo Co., Ltd. (Aica Kogyo)
3rd Author's Name Hideyuki Nakanishi  
3rd Author's Affiliation Aica Kogyo Co., Ltd. (Aica Kogyo)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Date Time 2013-01-25 13:35:00 
Presentation Time 50 
Registration for EMD 
Paper # IEICE-EMD2012-97 
Volume (vol) IEICE-112 
Number (no) no.415 
Page p.1 
#Pages IEICE-1 
Date of Issue IEICE-EMD-2013-01-18 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan