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| Presentation | 2012-10-26 13:50 Ultra high speed wet etching technology for a silicon wafer process Takeshi Sakai, Tatsuro Yoshida, Kazuhiro Yoshikawa, Tadahiro Ohmi (Tohoku Univ.)  SDM2012-97 Link to ES Tech. Rep. Archives: SDM2012-97 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The silicon wafer thinning technology is important in three-dimensional integrated technology. In this paper, we consider the silicon wafer thinning technology by Wet Etching. And, we propose new process with SOI wafer. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Three-dimensional integrated technology / Wet etching / Silicon wafer / Thinning technology / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 112, no. 263, SDM2012-97, pp. 41-45, Oct. 2012. | |
| Paper # | SDM2012-97 | |
| Date of Issue | 2012-10-18 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2012-97 Link to ES Tech. Rep. Archives: SDM2012-97 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2012-10-25 - 2012-10-26 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tohoku Univ. (Niche) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Process science and new process technologies |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2012-10-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Ultra high speed wet etching technology for a silicon wafer process |
| Sub Title (in English) | |
| Keyword(1) | Three-dimensional integrated technology |
| Keyword(2) | Wet etching |
| Keyword(3) | Silicon wafer |
| Keyword(4) | Thinning technology |
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| 1st Author's Name | Takeshi Sakai |
| 1st Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 2nd Author's Name | Tatsuro Yoshida |
| 2nd Author's Affiliation | Tohoku University (Tohoku Univ.) |
| 3rd Author's Name | Kazuhiro Yoshikawa |
| 3rd Author's Affiliation | Tohoku University/Apprecia Technology Inc. (Tohoku Univ.) |
| 4th Author's Name | Tadahiro Ohmi |
| 4th Author's Affiliation | Tohoku University (Tohoku Univ.) |
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| Speaker | Author-1 |
| Date Time | 2012-10-26 13:50:00 |
| Presentation Time | 25 minutes |
| Registration for | SDM |
| Paper # | SDM2012-97 |
| Volume (vol) | vol.112 |
| Number (no) | no.263 |
| Page | pp.41-45 |
| #Pages | 5 |
| Date of Issue | 2012-10-18 (SDM) |
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