IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2012-10-19 09:20
Experimental study on the microwave surface resistance of the copper-clad dielectric substrates
Yusuke Shimoda, Koichi Kikuchi, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.) MW2012-98 Link to ES Tech. Rep. Archives: MW2012-98
Abstract (in Japanese) (See Japanese page) 
(in English) Copper clad dielectric substrate is used for high-frequency planar circuits. The surface of the dielectric plate is roughened so that the adhesive bond strength between the dielectric plate and the copper film is enhanced. Because of the surface condition or roughness, the effective surface resistance of the copper film must be increased. But the influence of the surface condition on the surface resistance has been hardly investigated quantitatively so far. In this paper, for the copper clad dielectric substrate samples, the surface resistance and relative conductivity were measured in 3.5-30GHz by using two-dielectric-rod-resonator method and the surface roughness is also evaluated. As a result, the relationship between the surface resistance and the surface roughness is presented.
Keyword (in Japanese) (See Japanese page) 
(in English) Two-dielectric-rod-resonator method / Frequency dependence / Copper clad dielectric substrate / Microwave / Millimeter-wave / / /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 251, MW2012-98, pp. 99-104, Oct. 2012.
Paper # MW2012-98 
Date of Issue 2012-10-11 (MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2012-98 Link to ES Tech. Rep. Archives: MW2012-98

Conference Information
Committee MW  
Conference Date 2012-10-18 - 2012-10-19 
Place (in Japanese) (See Japanese page) 
Place (in English) Utsunomiya Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave Technologies 
Paper Information
Registration To MW 
Conference Code 2012-10-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Experimental study on the microwave surface resistance of the copper-clad dielectric substrates 
Sub Title (in English)  
Keyword(1) Two-dielectric-rod-resonator method  
Keyword(2) Frequency dependence  
Keyword(3) Copper clad dielectric substrate  
Keyword(4) Microwave  
Keyword(5) Millimeter-wave  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yusuke Shimoda  
1st Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
2nd Author's Name Koichi Kikuchi  
2nd Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
3rd Author's Name Takashi Shimizu  
3rd Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
4th Author's Name Yoshinori Kogami  
4th Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2012-10-19 09:20:00 
Presentation Time 20 minutes 
Registration for MW 
Paper # MW2012-98 
Volume (vol) vol.112 
Number (no) no.251 
Page pp.99-104 
#Pages
Date of Issue 2012-10-11 (MW) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan